Wiring board

Abstract

It is impossible to make a wiring board for noise suppression thinner, therefore, a wiring board according to an exemplary aspect of the invention includes a first wiring layer, an intermediate layer, and a second wiring layer; wherein the second wiring layer, the intermediate layer, and the first wiring layer are stacked in this order; the first wiring layer comprises a first wiring and a second wiring separated from the first wiring; the intermediate layer comprises a first via and a second via; the second wiring layer comprises a third wiring and a non-wiring portion where wirings are not formed; the first wiring is separated from the third wiring; the first via and the second via electrically connect the second wiring to the third wiring respectively; the non-wiring portion is located at a portion corresponding to an area between the first via and the second via; and the first wiring and the second wiring cross over the non-wiring portion.

Dependencies are inferred from the claim text.