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US 2014/0209366 A1Published application
Wiring board and method of manufacturing wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorsKazuyuki Kubota, Tomoharu Fujii
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Abstract
There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.
Claims6
A wiring board comprising:
- a first insulating layer;
- a secondary battery on one surface of the first insulating layer;
- a second insulating layer formed on the secondary battery;
- a third insulating layer covering the second insulating layer;
- a first wiring layer on one surface of the third insulating layer;
- and
- a via electrically connecting the first wiring layer to an electrode of the secondary battery,
- wherein a rigidity of the second insulating layer is lower than those of the first and third insulating layers.
5 more elements
Dependencies are inferred from the claim text.