Wiring board and method for manufacturing the same
AssigneeKyocera Slc Technologies Corporation
InventorsMakoto NAKAI, Takashi KATO
Life of this patent
Estimating the term…
Abstract
A wiring board according to the present invention has an insulating board 1 including a land conductor layer 14 on a surface thereof; an insulating layer 5 formed on the insulating board 1; a via hole 6 extending from an upper surface of the insulating layer 5 to the land conductor layer 14; a via conductor 7 formed in the via hole 6 and formed of a plated metal layer; and a wiring conductor 3b formed on the via conductor 7 and electrically connected to the via conductor 7, wherein the via hole 6 is provided with a protruding portion 8a formed of copper foil and protruding from a periphery of an opening of the via hole 6 toward a center of the opening.
Claims10
A wiring board comprising:
- an insulating board including a land conductor layer on a surface thereof;
- an insulating layer formed on the insulating board;
- a via hole reaching the land conductor layer from an upper surface of the insulating layer;
- a via conductor formed in the via hole and formed of a plated metal layer;
- and
- a wiring conductor formed on the via conductor and electrically connected to the via conductor,
- wherein the via hole is provided with a protruding portion formed of copper foil and protruding from a periphery of an opening of the via hole toward a center of the opening.
A method for manufacturing a wiring board, the method comprising the steps of:
- sequentially laminating an insulating layer and copper foil on an insulating board including a land conductor layer on a surface thereof;
- forming a via hole reaching the land conductor layer from an upper surface of the copper foil such that the via hole is provided with a protruding portion formed of the copper foil and protruding from a periphery of an opening of the via hole toward a center of the opening;
- forming, on the copper foil, a plating resist layer including an opening portion for exposing the via hole and a periphery thereof;
- forming a via conductor formed of a plated metal layer in the via hole and forming a wiring conductor in the opening portion of the plating resist layer;
- and
- removing the plating resist layer and the copper foil in a portion covered with the plating resist layer.
Dependencies are inferred from the claim text.