Power electronics interconnection for electric motor drives

A bus bar comprising:

• a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor;
• a first dielectric layer overlying a top surface of said first bus bar layer;
• and
• a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer, wherein:
• said first bus bar layer includes a first via for receipt of a first electrical lead of a first electrical component and a second via for receipt of a second electrical lead of said electrical component;
• said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer;
• said second bus bar layer includes a first plurality of electrically conductive mounting tabs formed from said second bus bar layer and extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer and wherein said first bus bar layer includes a second plurality of electrically conductive mounting tabs formed from said first bus bar layer and extending generally perpendicular to said first bus bar layer and through apertures in said first dielectric layer and said second bus bar layer, with said first and second plurality of electrically conductive mounting tabs extending about an equal distance from a top surface of said second bus bar layer;
• said first and second plurality of electrically conductive mounting tabs each include a mounting slot extending generally perpendicular to said second bus bar layer;
• and
• each said mounting slot is sized for receiving a respective first and second plurality of connection studs of a DC-Link capacitor of a high-power converter, with said mounting tabs mechanically and electrically supporting said DC-Link capacitor when mounted into said mounting slots using said plurality of connection studs wherein said DC-Link capacitor includes said first plurality of connection studs having a first polarity coupled to said first plurality of electrically conductive mounting tabs and said second plurality of connection studs having a second polarity coupled to said second plurality of electrically conductive mounting tabs.

A method comprising:

• a) forming a first bus bar layer into a desired three-dimensional form factor, said first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor;
• b) overlaying a first dielectric layer over a top surface of said first bus bar layer;
• c) forming a second bus bar layer conforming to said desired three-dimensional form factor, said second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer, wherein:
• said first bus bar layer includes a first via for receipt of a first electrical lead of a first electrical component and a second via for receipt of a second electrical lead of said electrical component;
• said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer;
• d) forming a first plurality of electrically conductive mounting tabs from said second bus bar layer with said first plurality of electrically conductive mounting tabs extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer;
• e) forming a second plurality of electrically conductive mounting tabs from said first bus bar layer with said second plurality of electrically conductive mounting tabs extending generally perpendicular to said first bus bar layer and extending through a second plurality of apertures in both said first dielectric layer and said second bus bar layer, wherein:
• said first and second plurality of electrically conductive mounting tabs extend about an equal distance away from a top surface of said second bus bar layer;
• said first and second plurality of electrically conductive mounting tabs each include a mounting slot extending generally perpendicular to said second bus bar layer;
• each said mounting slot is sized for receiving a respective first and second plurality of connection studs of a DC-Link capacitor of a high-power converter, with said mounting tabs mechanically and electrically supporting said DC-Link capacitor when mounted into said mounting slots using said plurality of connection studs;
• f) mounting the first plurality of connection studs of said DC-Link capacitor having a first polarity to said first plurality of electrically conductive mounting tabs;
• and
• g) mounting the second plurality of connection studs of said DC-Link capacitor having a second polarity to said second plurality of electrically conductive mounting tabs.