Method for manufacturing cooling device, cooling device and electronic component package equipped with cooling device
AssigneeFujitsu Limited
InventorsYuki HOSHINO, KENJI FUKUZONO
Life of this patent
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Abstract
A method for manufacturing an integral molded cooling device, a circulation channel of a refrigerant being formed in the inside of the cooling device, the method includes: laminating a channel forming plate, a top plate and a bottom plate, a plurality of comb tooth units being provided on the channel forming plate; and integrating the channel forming plate, the top plate and the bottom plate by diffusion joining.
Claims7
A method for manufacturing an integral molded cooling device, a circulation channel of a refrigerant being formed in the inside of the cooling device, the method comprising:
- laminating a channel forming plate, a top plate and a bottom plate, a plurality of comb tooth units being provided on the channel forming plate;
- and
- integrating the channel forming plate, the top plate and the bottom plate by diffusion joining.
A method for manufacturing an integral molded cooling device, a circulation channel of a refrigerant being formed in the inside of the cooling device, the method comprising:
- arranging, in a mold, a core for forming the circulation channel, and a powder material in which a main material is coated with a sub-material;
- sintering the powder material and changing the main material and the sub-material to an alloy having a melting point higher than a melting point of the core by heating the powder material;
- and
- melting and discharging the core.
A cooling device comprising:
- a plurality of comb-plate units;
- a circulation channel for a refrigerant divided with the comb-plate units;
- and
- a connector that extends in a direction crossing a circulation direction of the refrigerant, and connects the comb-plate units;
- wherein the cooling device has an integration structure by the same material.
An electronic component package comprising:
- a cooling device;
- and
- a substrate on which an electronic component and the cooling device are mounted;
- the cooling device including:
- a plurality of comb-plate units;
- a circulation channel for a refrigerant divided with the comb-plate units;
- and
- a connector that extends in a direction crossing a circulation direction of the refrigerant, and connects the comb-plate units;
- wherein the cooling device has an integration structure by the same material.
Dependencies are inferred from the claim text.