Apparatus and method for bonding substrates
AssigneeEV Group E. Thallner GmbH
InventorThomas Wagenleitner
Life of this patent
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Abstract
This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.
Claims18
A device for temporary bonding of a first substrate with a second substrate comprising:
- a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface of the mounting apparatus with
- a) an outer ring section for controllable fixing of the first substrate and
- b) an inner ring section having a recessed surface which is recessed from the mounting surface, said inner ring section further having at least one support surface for supporting the semiconductor substrate, the support surface being part of the mounting surface,
- deformation means for controllable deformation of the first substrate, the deformation means being made to act within the outer ring section and
- bonding means for bonding of the first substrate to the second substrate by removal of the deformed first substrate from the mounting apparatus.
A method for especially temporary bonding of a first substrate to a second substrate with the following steps, especially the following sequence:
- mounting the first substrate to a mounting contour with an active mounting surface of a mounting apparatus, with said mounting apparatus having
- a) an outer ring section for controllable fixing of the first substrate,
- b) an inner ring section having an area which is recessed from the mounting surface, wherein the mounting contour in the inner ring section has at least one support surface for supporting the semiconductor substrate, the support surface being included in the mounting surface,
- deforming a central portion of the first substrate within the outer ring section
- attaching the deformed portion of the first substrate to the second substrate by bonding means by separating the deformed first substrate from the mounting apparatus.
A device for temporary bonding of a first substrate to a second substrate, said device comprising:
- a mounting apparatus for holding said first substrate, said mounting apparatus comprised of an outer ring section and an inner ring section
- said outer ring section including a mounting contour having an active mounting surface for securing the periphery of a first substrate to said mounting apparatus
- said inner ring section defining an area recessed from said mounting surface, said inner ring section having at least one support surface for supporting an inner region of said first substrate, said support surface being spaced from said mounting surface, and
- deformation means for controllably deforming a central portion of said first substrate by forcing a central portion of said first substrate away from said mounting apparatus.
Dependencies are inferred from the claim text.