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US 2014/0209129 A1Published application
Method and apparatus for surface treatment using inorganic acid and ozone
AssigneeLam Research Corporation
InventorsHarald OKORN-SCHMIDT, Franz KUMNING, Rainer OBWEGER, Thomas WIRNSBERGER
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Abstract
Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture.
Claims7
An apparatus for treating a surface of an article, comprising:
- a chamber for receiving an article to be treated;
- a dispenser for dispensing a treatment liquid onto the article;
- a tank for storing an inorganic acid;
- an ozone generator in communication with said chamber or an acid supply line entering or exiting said tank;
- and
- a heater for rapidly heating a surface of an article to be treated to a temperature at least 30° C. greater than a temperature of the inorganic acid when applied to the article.
3 more elements
Dependencies are inferred from the claim text.