Film deposition apparatus

A film deposition apparatus for depositing a thin film on a substrate in a vacuum chamber, comprising:

• a turntable that rotates a substrate mounting area on which a substrate is mounted;
• a first process gas supply portion that supplies a first process gas to the substrate mounting area to form a first process area;
• a gas nozzle that functions as a second process gas supply portion provided to be apart from the first process gas supply portion in a circumferential direction of the vacuum chamber and supplies a second process gas capable of reacting with the first process gas to the substrate mounting area to form a second process area,
• the gas nozzle being provided to linearly extend in a direction crossing a moving direction of the substrate mounting area and provided with gas discharge holes along the longitudinal direction;
• a nozzle cover that is provided to cover the gas nozzle;
• a separation gas supply portion that supplies a separation gas to a separation area provided between the first process area and the second process area,
• wherein the nozzle cover includes
• an upper plate portion provided at an area between the gas nozzle and a ceiling surface of the vacuum chamber, and
• an upstream sidewall portion and a downstream sidewall portion that extend downward from upstream and downstream edge portions of the upper plate portion in a rotational direction of the turntable, respectively,
• wherein an inner surface of the upstream sidewall portion at the gas nozzle side is formed as an inclined surface that is inclined with respect to a surface of the turntable, and
• wherein an angle θ1 between the inner surface of the upstream sidewall portion at the gas nozzle side and the surface of the turntable is smaller than an angle θ2 between an inner surface of the downstream sidewall portion at the gas nozzle side and the surface of the turntable.