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US 2014/0208876 A1Published application
Sensors with modular threaded packaging
AssigneeMeggitt (Orange County), Inc.
InventorMargie Mattingly
Life of this patent
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Abstract
A modular piezoelectric sensor system, wherein the system comprises: a sensor pod including at least one standard sensor interface; and a plurality of different mounting adapters that include different external mounting interfaces wherein each mounting adapter has at least one complementary standard sensor interface.
Claims20
A system for installing a piezoelectric sensor, the system comprising:
- a sensor pod including at least one standard sensor interface;
- and
- a plurality of different mounting adapters that include different external mounting interfaces, wherein each mounting adapter has at least one complementary standard sensor interface.
A modular system of piezoelectric sensors, the system comprising:
- a plurality of sensor pods with varying sensitivities wherein each sensor pod includes at least one standard sensor interface;
- and
- a mounting adapter with an external mounting interface and at least one complementary standard sensor interface.
A method of providing a plurality of piezoelectric sensors with different mounting interfaces comprising:
- manufacturing a plurality of sensor pods each with the same standard sensor interface;
- and
- manufacturing a plurality of mounting adapters with different external interfaces but each with a complementary standard sensor interface.
Dependencies are inferred from the claim text.