Electronic component mounting line and electronic component mounting method

An electronic component mounting method in which a first electronic component and a second electronic component are mounted on a substrate that is being moved from upstream to downstream on an electronic component mounting line, the first electronic component having connection terminals for solder paste connection, the second component having solder bumps, the method comprising:

• a first step of preparing the substrate including:
• a first placement area having first electrodes for connection to the connection terminals;
• and a second placement area having second electrodes for connection to the solder bumps;
• a second step of applying a solder paste to the first electrodes, by using a screen printing machine arranged on the electronic component mounting line;
• a third step of placing the first electronic component on the substrate such that the connection terminals land on the solder paste on the corresponding first electrodes, by using a first electronic component placement machine arranged on the electronic component mounting line;
• a fourth step of dispensing a thermosetting resin onto at least one reinforcement position arranged on a peripheral edge portion of the second placement area, by using a resin dispensing machine arranged on the electronic component mounting line;
• a fifth step of placing the second electronic component on the substrate such that the solder bumps land on the corresponding second electrodes;
• and bringing the thermosetting resin that has been applied to the reinforcement position, in contact with a peripheral edge portion of the second electronic component, by using a second electronic component placement machine arranged on the electronic component mounting line;
• and
• a sixth step of bonding the first and second electronic components to the substrate by heating the substrate on which the first and second electronic components have been placed, to melt the solder paste and the solder bumps and to cure the thermosetting resin, by using a reflow machine arranged on the electronic component mounting line;
• and then cooling the substrate,
• the fifth step being performed by using the second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine.