Joining device and joining system
AssigneeTokyo Electron Limited
InventorsShintaro SUGIHARA, Naoto YOSHITAKA, Shigenori KITAHARA, Keizo HIROSE
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Abstract
A joining device for joining substrates together includes a first chuck configured to draw and hold a first substrate on a lower surface thereof, a second chuck provided below the first chuck and configured to draw and hold a second substrate on an upper surface thereof, and a chuck holding unit provided below the second chuck, the chuck holding unit including an upper surface and suction grooves annularly formed on the upper surface of the chuck holding unit, the suction grooves configured to vacuum-suck the second chuck to draw and hold the second chuck.
Claims5
A joining device for joining substrates together, comprising:
- a first chuck configured to draw and hold a first substrate on a lower surface thereof;
- a second chuck provided below the first chuck and configured to draw and hold a second substrate on an upper surface thereof;
- and
- a chuck holding unit provided below the second chuck, the chuck holding unit including an upper surface and suction grooves annularly formed on the upper surface of the chuck holding unit, the suction grooves configured to vacuum-suck the second chuck to draw and hold the second chuck.
Dependencies are inferred from the claim text.