Apparatus and method for encapsulating tritium
AssigneeCammenga Company, LLC
InventorsChristopher J. Karchon, Alexander J. Karchon, Robert J. Henderson
Life of this patent
Estimating the term…
Abstract
A module comprising: one or more vials containing tritium; one or more tritium covers; and an open space within the one or more tritium covers, wherein the one or more vials containing tritium are located within the open space of the one or more tritium covers so that the one or more tritium covers protect the one or more vials containing tritium, and wherein the one or more tritium covers are made from a material that exhibits sufficient strength so that the module protects the one or more vials containing tritium from damage when dropped from a distance of 1 m or more.
Claims20
A module comprising:
- one or more vials containing tritium;
- one or more tritium covers;
- and
- an open space within the one or more tritium covers,
- wherein the one or more vials containing tritium are located within the open space of the one or more tritium covers so that the one or more tritium covers protect the one or more vials containing tritium, and
- wherein the one or more tritium covers are made from a material that exhibits sufficient strength so that the module protects the one or more vials containing tritium from damage when dropped from a distance of 1 m or more.
An article of manufacture comprising:
- one or more voids, through-holes, recesses, holes, or a combination thereof;
- one or more modules comprising:
- one or more vials containing tritium;
- one or more tritium covers;
- and
- an open space within the one or more tritium covers,
- wherein the one or more vials containing tritium are located within the open space of the one or more tritium covers so that the one or more tritium covers protect the one or more vials containing tritium, and
- wherein the one or more tritium covers are made from a material that exhibits sufficient strength so that the module protects the one or more vials containing tritium from breaking when dropped from a distance of 1 m or more;
- wherein the one or more modules are placed in the one or more voids, through-holes, recesses, holes, or a combination thereof.
A method comprising:
- injection molding one or more tritium covers and
- injection molding one or more tritium holders and
- bonding one or more tritium vials to the one or more tritium holders and
- bonding the one or more tritium covers to the one or more tritium holders.
Dependencies are inferred from the claim text.