# US 2014/0198185 A1 · Multi-camera sensor for three-dimensional imaging of a circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0198185 A1 - Document ID: US20140198185A1 - Status: Published application - Kind: A1 - Application number: 14/154,838 - Filed: 2014-01-14 - Published: 2014-07-17 - Earliest claimed: 2013-01-17 - Assignees: CyberOptics Corporation - Applicants: CyberOptics Corporation - Inventors: Paul R. Haugen; Eric P. Rudd - Web page: https://patentgrep.com/patent/US20140198185A1 ## CPC - G06T 7/0008: {checking presence/absence} - G01B 11/2513: {with several lines being projected in more than one direction, e.g. grids, patterns} - G01B 11/2545: {with one projection direction and several detection directions, e.g. stereo} - G06T 7/0004: {Industrial image inspection} - G06T 7/521: from laser ranging, e.g. using interferometry; from the projection of structured light - G06T 7/593: from stereo images - H05K 13/0815: {Controlling of component placement on the substrate during or after manufacturing} - H05K 13/0817: {Monitoring of soldering processes (inspection of solder joints or of printed solder paste G01N21/95684)} - G06T 2207/10016: Video; Image sequence - G06T 2207/10024: Color image - G06T 2207/30141: Printed circuit board [PCB] - G06T 2207/30152: Solder - H04N 13/243: using three or more two-dimensional [2D] image sensors - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source projects an illumination pattern from a first angle of incidence. A first camera acquires an image of the structured light pattern on the circuit board from a second angle of incidence. A second camera simultaneously acquires an image of the structured light pattern on the circuit board from a third angle of incidence, the third angle of incidence differing from the second angle of incidence. A controller is coupled to the illumination source and to the at least two camera devices. The controller generates a height topology of the circuit board based on images acquired from the at least two camera devices of the structure light illuminator. ## Claims ### Claim 1 A system for sensing a three-dimensional topology of a circuit board, the system comprising: an illumination source configured to project a patterned illumination on the circuit board from a first angle of incidence; a first camera configured to acquire an image of the pattern illumination from a second angle of incidence; a second camera configured to acquire an image of the pattern illumination from a third angle of incidence; and a controller coupled to the illumination source and to the first and second cameras, the controller being configured to generate a height image of the circuit board based on images acquired of projected pattern illumination on the circuit board with the first and second cameras. ### Claim 2 (depends on 1) The system of claim 1 wherein images acquired by the first and second cameras are combined to produce a single height image. ### Claim 3 (depends on 1) The system of claim 1, wherein the circuit board is populated with solder paste deposits ### Claim 4 (depends on 1) The system of claim 1, wherein the circuit board is populated with electrical components ### Claim 5 (depends on 1) The system of claim 1, wherein the illumination source includes a programmable spatial light modulator configured to generate multiple patterns in sequence ### Claim 6 (depends on 5) The spatial light modulator of claim 5, wherein the spatial light modulator projects patterns of varying spatial frequency. ### Claim 7 A method of three-dimensionally mapping an image of a circuit board, the method comprising: projecting a pattern image onto the circuit board from a first incident angle; simultaneously capturing a first plurality of fringe phase images of the circuit board from a second incident angle and a third incidence angle; simultaneously capturing a second plurality of fringe phase images of the circuit board from the second incidence angle and the third incident angle; simultaneously capturing a third plurality of fringe phase images of the circuit board from the second incidence angle and the third incidence angle; wherein the first, second and third pluralities of fringe phase images are captured while patterned illumination is disposed on the circuit board; and computing a height map based on the first, second, and third plurality of fringe phase images. ### Claim 8 (depends on 7) The method of claim 7, wherein at least one of the first, second and third pluralities of fringe phase images are also used for stereoscopic height analysis. ### Claim 9 (depends on 7) The method of claim 7, wherein the pattern image is varied between acquisition of the first and second pluralities of fringe phase images. ### Claim 10 (depends on 9) The method of claim 9, wherein the pattern image is varied between acquisition of the second and third pluralities of fringe phase images. ### Claim 11 (depends on 9) The method of claim 9, wherein the pattern image is varied using a spatial light modulator. ### Claim 12 A system for generating a three-dimensional height image of a test target, the system comprising: an illumination source configured to generate a patterned illumination on the test surface; a first camera configured to acquire a first image of the patterned illumination from a first point of view; a second camera configured to acquire a second image of the patterned illumination from a second point of view; the first and second cameras having different configurations; and a controller coupled to the illumination source and to the first and second cameras, the controller being configured to generate a height image of the test surface based on the first and second images acquired of said patterned illumination, the height image being enhanced by a combination of the different configurations of the first and second cameras. ### Claim 13 (depends on 12) The system of claim 12, wherein the test target is a circuit board with solder paste deposits. ### Claim 14 (depends on 12) The system of claim 12, wherein the test target is a circuit board populated with electrical components. ### Claim 15 (depends on 12) The system of claim 12, wherein the first camera is configured to acquired color images and the second camera is configured to acquire monochrome images. ### Claim 16 (depends on 12) The system of claim 12, wherein the first camera is configured with a short exposure time and the second camera is configured with relatively longer exposure time. ### Claim 17 (depends on 12) The system of claim 12, wherein the first camera is configured with a larger optical magnification than the second camera. ### Claim 18 (depends on 12) The system of claim 12, wherein the first camera is configured with an incident angle and the second camera is configured with a larger incident angle. ### Claim 19 A system for generating a three-dimensional height image of a test target, the system comprising: an illumination source configured to generate a patterned illumination on the test target; a first pair of cameras configured to acquire a first image pair of the patterned illumination from a first point of view; a second pair of cameras configured to acquire a second image pair of the patterned illumination from a second point of view; the first and second pairs of cameras having different configurations; and a controller coupled to the source and to the first and second pairs of cameras, the controller being configured to generate a height image of the test target based on first and second image pairs acquired of said patterned illumination, the height image being enhanced by a combination of the different configurations of the first and second image pairs. ### Claim 20 (depends on 19) The system of claim 19, wherein the first pair of cameras is configured to acquire color images and the second pair of cameras is configured to acquire monochrome images. ### Claim 21 (depends on 19) The system of claim 19, wherein the first pair of cameras is configured with a short exposure time and the second pair of cameras is configured with relatively longer exposure time. ### Claim 22 (depends on 19) The system of claim 19, wherein the first pair of cameras is configured with a larger optical magnification than the second pair of cameras. ### Claim 23 (depends on 19) The system of claim 19, wherein the first pair of cameras is configured with first incident angles and the second pair of cameras are configured with second incident angles larger than the first incident angles. ### Claim 25 A method of three-dimensionally mapping an image of a test surface, the method comprising: projecting a plurality of illumination patterns onto the test surface from a first point of view; capturing a first plurality of images of the test surface from a second point of view with a first camera configuration while the illumination patterns are disposed upon the test surface; capturing a second plurality of images of the test surface from a third point of view with a second camera configuration while illumination patterns are disposed upon the test surface; computing a height map of the test surface using the first and second plurality of illumination patterns images captured by the first and second camera configurations. ### Claim 26 (depends on 25) The method of claim 25, wherein the camera configurations are designed to improve the resolution of the resulting height image generated from the combined first and second plurality of illumination patterns images.