# US 2014/0197899 A1 · Printed circuit board and manufacturing method of printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197899 A1 - Document ID: US20140197899A1 - Status: Published application - Kind: A1 - Application number: 14/082,233 - Filed: 2013-11-18 - Published: 2014-07-17 - Earliest claimed: 2013-01-15 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Kenichi KAWAI - Web page: https://patentgrep.com/patent/US20140197899A1 ## CPC - H01P 3/08: Microstrips; Strip lines - H01P 11/001: {Manufacturing waveguides or transmission lines of the waveguide type} - H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines} - H05K 1/0289: {having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes} - H05K 1/0222: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence} - Y10T 29/49162: by using wire as conductive path - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via. ## Claims ### Claim 1 A printed circuit board comprising: a plurality of wiring layers; and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via. ### Claim 2 (depends on 1) The printed circuit board according to claim 1, wherein the locus is a perpendicular bisector of a line segment that connects together the paired-vias possessed by another differential signal via. ### Claim 3 (depends on 1) The printed circuit board according to claim 1, wherein the plurality of differential signal vias configures a matrix including arrays disposed lengthwise and crosswise, in which the specified differential signal via and another differential signal via are alternately arranged, and the printed circuit board further comprises a GND via disposed between the differential signal vias configuring oblique arrays of the matrix. ### Claim 4 (depends on 1) The printed circuit board according to claim 1, wherein the wiring layers are formed with wiring lines connected to the differential signal vias, and the wiring lines are formed sideways of the specified differential signal via in a pattern parallel to a direction in which the paired-vias possessed by the specified differential signal via is arranged. ### Claim 5 (depends on 1) The printed circuit board according to claim 1, wherein the wiring layers are formed with wiring lines connected to the differential signal vias in a predetermined direction from the differential signal vias, and the plurality of differential signal vias is formed so that arrays of a matrix configured by disposing lengthwise and crosswise the arrays, in which the specified differential signal via and another differential signal via are alternately arranged, are oriented in a direction oblique to the predetermined direction. ### Claim 6 A manufacturing method of a printed circuit board, the manufacturing method comprising: forming, on a plurality of wiring layers, a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via. ### Claim 7 (depends on 6) The manufacturing method of the printed circuit board according to claim 6, wherein the locus is a perpendicular bisector of a line segment that connects together the paired-vias possessed by another differential signal via. ### Claim 8 (depends on 6) The manufacturing method of the printed circuit board according to claim 6, wherein the plurality of differential signal vias configures a matrix including arrays disposed lengthwise and crosswise, in which the specified differential signal via and another differential signal via are alternately arranged, and the printed circuit board further comprises GND vias disposed between the differential signal vias configuring oblique arrays of the matrix. ### Claim 9 (depends on 6) The manufacturing method of the printed circuit board according to claim 6, wherein the wiring layers are formed with wiring lines connected to the differential signal vias, and the wiring lines are formed sideways of the specified differential signal via in a pattern parallel to a direction in which the paired-vias possessed by the specified differential signal via are arranged. ### Claim 10 (depends on 6) The manufacturing method of the printed circuit board according to claim 6, wherein the wiring layers are formed with wiring lines connected to the differential signal vias in a predetermined direction from the differential signal vias, and the plurality of differential signal vias is formed so that arrays of a matrix configured by disposing lengthwise and crosswise the arrays, in which the specified differential signal via and another differential signal via are alternately arranged, are oriented in a direction oblique to the predetermined direction.