# US 2014/0197550 A1 · Semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197550 A1 - Document ID: US20140197550A1 - Status: Published application - Kind: A1 - Application number: 14/015,352 - Filed: 2013-08-30 - Published: 2014-07-17 - Earliest claimed: 2013-01-15 - Assignees: Kabushiki Kaisha Toshiba - Applicants: Kabushiki Kaisha Toshiba - Inventors: Akihiro IIDA; Akihito ISHIMURA; Hiroshi INAGAKI - Web page: https://patentgrep.com/patent/US20140197550A1 ## CPC - H10W 90/00: Package configurations - H10W 70/68: Shapes or dispositions thereof - H10W 44/248: {for antennas} - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 70/685: comprising multiple insulating layers - H10W 72/354: {comprising polymers} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/5522: {comprising gold [Au]} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/114: {by a substrate and the encapsulations} - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/752: {between stacked chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction. ## Claims ### Claim 1 A semiconductor device, comprising: a substrate; a height adjuster mounted on a surface of the substrate via a first adhesive layer; a semiconductor chip mounted on the height adjuster via a second adhesive layer; an electronic component mounted on the surface of the substrate via a third adhesive layer and disposed apart from the height adjuster and the semiconductor chip; a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component; and a sealing member covering the substrate, the first adhesive layer, the height adjuster, the second adhesive layer, the semiconductor chip, the third adhesive layer, the electronic component, and the bonding wire, wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction. ### Claim 2 (depends on 1) The device according to claim 1, wherein the semiconductor chip is mounted in such a manner that the center of the semiconductor chip is offset from the center of the height adjuster. ### Claim 3 (depends on 2) The device according to claim 2, wherein the sum of the lengths of the height adjuster and the first adhesive layer in the first direction is larger than the sum of the lengths of the electronic component and the third adhesive layer in the first direction. ### Claim 4 (depends on 1) The device according to claim 1, wherein the height adjuster is not electrically connected with the substrate. ### Claim 5 (depends on 1) The device according to claim 1, wherein a portion of the semiconductor chip is not supported by the height adjuster. ### Claim 6 (depends on 1) The device according to claim 1, further comprising a second semiconductor chip mounted on the first semiconductor chip via a fourth adhesive layer and a portion of the second semiconductor chip is not supported by the first semiconductor chip. ### Claim 7 (depends on 1) The device according to claim 1, wherein a portion of the height adjuster is not supported by the substrate. ### Claim 8 (depends on 7) The device according to claim 7, wherein a portion of the semiconductor chip is not supported by the height adjuster and said portion is disposed above the electronic component. ### Claim 9 (depends on 8) The device according to claim 8, further comprising: a pair of support members mounted on the substrate on which respective edges of said portion are supported, wherein the electronic component is disposed between the pair of support members. ### Claim 10 (depends on 8) The device according to claim 8, further comprising: an antenna mounted on the height adjuster. ### Claim 11 (depends on 7) The device according to claim 7, wherein a first side of the semiconductor chip facing the electronic component and a first side of the height adjuster facing the electronic component are aligned, and a second side of the semiconductor chip opposite the first side of the semiconductor chip and a second side of the height adjuster opposite the first side of the height adjuster are not aligned. ### Claim 12 (depends on 7) The device according to claim 7, wherein a first side of the semiconductor chip facing the electronic component and a first side of the height adjuster facing the electronic component are not aligned, and a second side of the semiconductor chip opposite the first side of the semiconductor chip and a second side of the height adjuster opposite the first side of the height adjuster are not aligned. ### Claim 13 (depends on 1) The device according to claim 1, further comprising: a passive component mounted on the substrate and covered by the sealing member, having a length in the first direction that is greater than the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction. ### Claim 14 (depends on 1) The device according to claim 1, wherein the sealing member is a thermosetting resin. ### Claim 15 A semiconductor device, comprising: a substrate; a semiconductor chip mounted on an upper surface of the substrate via a first adhesive layer; an electronic component mounted on the upper surface of the substrate via a second adhesive layer and disposed apart from the semiconductor chip; a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component; and a sealing member covering the substrate, the first adhesive layer, the semiconductor chip, the second adhesive layer, the electronic component, and the bonding wire, wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and an upper surface of the semiconductor chip is located farther from the upper surface of the substrate than an upper surface of the electronic component. ### Claim 16 (depends on 15) The device according to claim 15, wherein the substrate has a raised portion and the semiconductor chip is mounted on the raised portion. ### Claim 17 (depends on 15) The device according to claim 15, wherein the thickness of the first adhesive layer is larger than the thickness of the second adhesive layer. ### Claim 18 A semiconductor device, comprising: a substrate; a height adjuster mounted on a surface of the substrate via a first adhesive layer; a semiconductor chip mounted on the height adjuster via a second adhesive layer; an electronic component mounted on the height adjuster via a third adhesive layer; a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component; a passive component mounted on the surface of the substrate via a fourth adhesive layer; and a sealing member covering the substrate, the first adhesive layer, the height adjuster, the second adhesive layer, the semiconductor chip, the third adhesive layer, the electronic component, the fourth adhesive layer, the passive component, and the bonding wire, wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the length of the passive component in the first direction is greater than the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction. ### Claim 19 (depends on 18) The device according to claim 18, wherein the electronic component is mounted directly on the height adjuster via the third adhesive layer. ### Claim 20 (depends on 18) The device according to claim 18, wherein the electronic component is mounted directly on the semiconductor chip via the third adhesive layer.