# US 2014/0197532 A1 · Semiconductor Module and Method for Manufacturing Semiconductor Module

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- Number: US 2014/0197532 A1
- Document ID: US20140197532A1
- Status: Published application
- Kind: A1
- Application number: 13/983,291
- Filed: 2011-03-04
- Published: 2014-07-17
- Earliest claimed: 2011-03-04
- Assignees: Hitachi Automotive Systems, Ltd.
- Inventors: Eiichi Ide; Takeshi Tokuyama; Nobutake Tsuyuno; Kinya Nakatsu; Tokihito Suwa; Yuujiro Kaneko
- Web page: https://patentgrep.com/patent/US20140197532A1

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H05K 7/20927: {Liquid coolant without phase change}
- H10W 40/10: Arrangements for heating
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 40/77: Auxiliary members characterised by their shape
- H10W 72/071: {Connecting or disconnecting}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/07351: {characterised by changes in properties of the die-attach connectors during connecting}
- H10W 72/07354: {changes in dispositions}
- H10W 72/30: Die-attach connectors
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/00: Package configurations
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/763: {between laterally-adjacent chips}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.

## Claims

### Claim 1

A semiconductor module comprising:
a case including a receiving space which is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween, the pair of wall portions including a heat dissipation portion and a support wall which supports the heat dissipation portion at the frame portion;
a plurality of semiconductor device blocks which are disposed in parallel in the receiving space while facing the wall portion, wherein a conductor plate is joined to each of electrode surfaces formed at both sides of a semiconductor device;
a plurality of insulating sheet members which are respectively interposed between the respective conductor plates and an inner periphery of the wall portion to insulate the respective conductor plates and the inner periphery of the wall portion; and
a resin composition member which is filled in the receiving space to seal the plurality of semiconductor device blocks,
wherein
the heat dissipation portion provided at least one side of the wall portion includes a plurality of separate heat dissipation portions disposed to face the plurality of semiconductor device blocks respectively, and
the plurality of separate heat dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat dissipation portion inside the case such that the plurality of insulating sheet members is closely joined to the plurality of conductor plates and the plurality of separate heat dissipation portions respectively.

### Claim 2 (depends on 1)

The semiconductor module according to claim 1, wherein
the conductor plate includes a connection portion which is bent and formed a semiconductor device side and is connected to the conductor plate of the other semiconductor device blocks disposed in parallel.

### Claim 3 (depends on 1)

The semiconductor module according to claim 1, wherein
the conductor plate has an inclined surface or an uneven surface formed at an end portion of a surface facing the insulating sheet member, and
the resin composition member is filled into a gap between the inclined surface or the uneven surface and the insulating sheet member.

### Claim 4 (depends on 1)

The semiconductor module according to claim 1, wherein
a thermal conductivity of the insulating sheet member is higher than a thermal conductivity of the resin composition member.

### Claim 5 (depends on 1)

The semiconductor module according to claim 1, wherein
a polyamide resin layer is formed between the semiconductor device block, the insulating sheet member, the inner periphery of the case, and the resin composition member.

### Claim 6 (depends on 1)

The semiconductor module according to claim 1, comprising:
a position determining unit which determines a position of the plurality of semiconductor device blocks in the receiving space.

### Claim 7 (depends on 1)

A method for manufacturing the semiconductor module according to claim 1, comprising:
fixing the insulating sheet member to the conductor plate provided in the semiconductor device block;
disposing the plurality of semiconductor device blocks, to which the insulating sheet member is fixed, in parallel in the receiving space such that the insulating sheet member faces the corresponding separate heat dissipation portion;
pressing each of the separate heat dissipation portions toward the inside of the case to deform the support wall and join the separate heat dissipation portion closely to the insulating sheet member; and
filling the resin composition member into the receiving space to seal the plurality of semiconductor device blocks.

### Claim 8 (depends on 7)

The method according to claim 7, wherein
after deforming the support wall and joining the separate heat dissipation portion closely to the insulating sheet member,
the polyamide resin layer is formed by attaching a polyamide resin to the inner periphery of the case and the plurality of semiconductor device blocks received in the receiving space, and
the plurality of semiconductor device blocks is sealed by filling the resin composition member into the receiving space.