# US 2014/0197528 A1 · Optical semiconductor apparatus

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- Number: US 2014/0197528 A1
- Document ID: US20140197528A1
- Status: Published application
- Kind: A1
- Application number: 14/237,330
- Filed: 2012-08-17
- Published: 2014-07-17
- Earliest claimed: 2011-08-22
- Assignees: KYOCERA Corporation
- Inventors: Michikazu Nagata
- Web page: https://patentgrep.com/patent/US20140197528A1

## CPC

- H10W 76/12: characterised by their shape
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10H 20/8506: {Containers}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An optical semiconductor apparatus includes a lid body bonded to an upper surface of a frame body, the lid body having an opening at a position vertically overlapping with an optical semiconductor device. The lid body has a first portion which is positioned to surround the opening and has an upper surface to which a light-transmissive member is bonded, a second portion which is positioned to surround the first portion, and a third portion which is positioned to surround the second portion and has a lower surface to which the frame body is bonded. The upper surface of the first portion is positioned lower than an upper surface of the third portion. The second portion has a thin-walled portion positioned to surround the first portion, the thin-walled portion having a thickness thinner than that of the first portion as well as thinner than that of the third portion.

## Claims

### Claim 1

An optical semiconductor apparatus, comprising:
a substrate;
an optical semiconductor device placed on an upper surface of the substrate;
a frame body disposed on the upper surface of the substrate to surround the optical semiconductor device;
a lid body bonded to an upper surface of the frame body, the lid body having an opening at a position vertically overlapping with the optical semiconductor device; and
a light-transmissive member bonded to an upper surface of the lid body to cover the opening,
the lid body having a first portion which is positioned to surround the opening and has an upper surface to which the light-transmissive member is bonded, a second portion which is positioned to surround the first portion, and a third portion which is positioned to surround the second portion and has a lower surface to which the frame body is bonded, and
the upper surface of the first portion being positioned lower than an upper surface of the third portion, and the second portion having a thin-walled portion positioned to surround the first portion, the thin-walled portion having a thickness thinner than a thickness of the first portion as well as thinner than a thickness of the third portion.

### Claim 2 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein the first portion is a ring-shaped portion positioned to surround the opening.

### Claim 3 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein the upper surface of the first portion is positioned higher than an upper surface of the thin-walled portion.

### Claim 4 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein the light-transmissive member has a square-plate shape and bonded only to the first portion, the thin-walled portion is connected to the first portion, and the upper surface of the thin-walled portion is apart from a lower surface of the light-transmissive member.

### Claim 5 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein a height position of an upper surface of the light-transmissive member is lower than a height position of an upper surface of the second portion at a place adjacent to the third portion.

### Claim 6 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein a height position of an upper surface of the light-transmissive member is set so as to correspond to a height position of an upper surface of the second portion at a place adjacent to the third portion.

### Claim 7 (depends on 1)

The optical semiconductor apparatus according to claim 1, wherein a peripheral region surrounding a central region on a lower surface of the light-transmissive member is concave so that the peripheral region is positioned higher than the central region, and the first portion is bonded to a concave portion of the light-transmissive member.