# US 2014/0197525 A1 · Power module

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0197525 A1
- Document ID: US20140197525A1
- Status: Published application
- Kind: A1
- Application number: 14/117,165
- Filed: 2011-05-16
- Published: 2014-07-17
- Earliest claimed: 2011-05-16
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Inventors: Takuya Kadoguchi; Yoshikazu Suzuki; Masaya Kaji; Takanori Kawashima
- Web page: https://patentgrep.com/patent/US20140197525A1

## CPC

- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/20: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 72/30: Die-attach connectors
- H10W 74/016: {using moulds}
- H10W 72/07554: {changes in dispositions}
- H10W 72/381: {Auxiliary members}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/00: Package configurations
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

## Claims

### Claim 1

A power module comprising:
a first electrode;
a first switching device bonded on a surface of the first electrode;
a second electrode;
a second switching device bonded on the second electrodes;
a third electrode, the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode being arranged in this order from a bottom in a stacking direction;
first through third electrode pieces each connected to the first through third electrodes;
first and second signal lines each connected to the first and second switching devices,
wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

### Claim 2 (depends on 1)

The power module as claimed in claim 1,
wherein the first switching device has an area that is not covered with the second electrode in the stacking direction.

### Claim 3 (depends on 2)

The power module as claimed in claim 2,
wherein the first through third electrode pieces and the first and second signal lines are formed on a same lead frame.

### Claim 4 (depends on 3)

The power module as claimed in claim 3,
wherein a bonding part of the third electrode piece has an area that does not cover the first and second electrode pieces in the stacking direction.

### Claim 5 (depends on 4)

The power module as claimed in claim 4,
wherein the first through third electrode pieces and the first and second signal lines are provided opposite to each other through the second electrode.

### Claim 6 (depends on 5)

The power module as claimed in claim 5,
wherein the first and second signal lines are respectively connected to the first and second switching devices by wire bonding.

### Claim 7 (depends on 6)

The power module as claimed in claim 6,
wherein the first and second electrodes are congruent in shape.

### Claim 8 (depends on 7)

The power module as claimed in claim 7,
wherein the first and second electrodes have a rectangular shape.

### Claim 9 (depends on 8)

The power module as claimed in claim 8,
wherein the first switching device and the second electrode, and the second switching device and the third electrode are stacked through spacers made of a metal block.

### Claim 10 (depends on 9)

The power module as claimed in claim 9,
wherein the first through third electrodes, the first through third electrode pieces and the first and second signal lines are sealed with resin by molding so that only outside parts of the first through third electrodes and the first and second signal lines are exposed from the resin.
