# US 2014/0197524 A1 · Die package structure

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- Number: US 2014/0197524 A1
- Document ID: US20140197524A1
- Status: Published application
- Kind: A1
- Application number: 13/920,468
- Filed: 2013-06-18
- Published: 2014-07-17
- Earliest claimed: 2013-01-16
- Assignees: Inovative Turnkey Solution Corporation
- Applicants: Inovative Turnkey Solution Corporation
- Inventors: Shih-Chi CHEN
- Web page: https://patentgrep.com/patent/US20140197524A1

## CPC

- H10W 70/68: Shapes or dispositions thereof
- H10W 70/415: {Leadframe inner leads serving as die pads}
- H10W 70/688: {Flexible insulating substrates}
- H10W 72/0198: {batch processes}
- H10W 72/075: {of bond wires}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A die packaged structure includes a pad on the central region of the die. A packaged substrate with an opening disposed in the central region, and a connecting terminal is passed through the packaged substrate and disposed around the opening. An external connecting terminal is disposed on the four sides of the packaged substrate. A first metal wire is electrically connected the connecting terminal with the external connecting terminal, and the back of the packaged substrate is fixed on the die, such that the pad is exposed on the opening. A second metal wire is electrically connected the pad with the connecting terminal. A packaged body is encapsulated the packaged substrate, the die and the second metal wire, and the external connecting terminal is exposed. A conductive component is electrically connected with the external connecting terminal and is arranged on the four sides of the die packaged structure.

## Claims

### Claim 1

A die packaged structure, comprising:
a die, said die having an active surface and a back surface, and a plurality of pads is disposed in a central region of said active surface of said die;
a packaged substrate, said packaged substrate having a front surface and back surface, an opening is disposed in a central region of said packaged substrate, a plurality of connecting terminals is disposed on four sides of said packaged substrate, and said plurality connecting terminals is electrically connected with said plurality of external connecting terminals by a plurality of first metal wires, in which said back surface of said packaged substrate is fixed on said die by an adhesive layer, such that said plurality of pads in said central region of said die is exposed on said opening of said packaged substrate;
a plurality of second metal wires, said plurality of second metal wires is electrically connected said plurality of connecting terminals in said central region of said packaged substrate with said plurality of pads in said central region of said die;
a packaged body, said packaged body is encapsulated said packaged substrate, said die and said plurality of first metal wires and said plurality of external connecting terminals on said packaged substrate being exposed; and
a plurality of conductive components, said plurality of conductive components is electrically connected with said plurality of external terminals and is arranged on said four sides of said packaged substrate.

### Claim 2 (depends on 1)

The die package structure according to claim 1, wherein said packaged substrate region is a print circuit board.

### Claim 3 (depends on 1)

The die package structure according to claim 1, wherein the size of said print circuit board is smaller than that of said die.

### Claim 4 (depends on 1)

The die package structure according to claim 1, wherein said packaged substrate region is a flexible print circuit board.

### Claim 5 (depends on 1)

The die package structure according to claim 1, wherein the size of said packaged substrate region is smaller than that of said die.

### Claim 6 (depends on 1)

The die package structure according to claim 1, wherein height of said plurality of conductive components is identical to a total height of said packaged substrate and said packaged body.

### Claim 7

A die package structure, comprising:
a die, said die having an active surface and a back surface, and a plurality of pads disposed in a central region of said active surface of said die;
a packaged substrate, said packaged substrate having a front surface and a back surface, and an opening is disposed in a central region of said package substrate, a plurality of connecting terminals is disposed around said opening, a plurality of external connecting terminals is disposed on four sides of said packaged substrate, and said plurality of connecting terminals is electrically connected with said plurality of external connecting terminals by a plurality of first metal wires, in which said back surface of said packaged substrate is fixed on said die by an adhesive layer, such that said plurality of pads in said central region of said die is exposed on said opening of said packaged substrate;
a plurality of second metal wires, said plurality of second metal wires is electrically connected said plurality of connecting terminals in said central region of said packaged substrate with said plurality of pads in said central region of said die; and
a packaged body, said packaged body is encapsulated said packaged substrate, said active surface of said die and said plurality of second metal wires and said plurality of external connecting terminals is exposed outside of said packaged body.

### Claim 8 (depends on 7)

The die packaged structure according to claim 7, wherein said packaged substrate region is a print circuit board.

### Claim 9 (depends on 8)

The die packaged structure according to claim 8, wherein a size of said packaged substrate region is smaller than that of said die.

### Claim 10 (depends on 7)

The die packaged structure according to claim 7, wherein said packaged substrate region is a flexible print circuit board.

### Claim 11 (depends on 7)

The die packaged structure according to claim 7, wherein a size of said packaged substrate region is smaller than that of said die.

### Claim 12 (depends on 7)

The die packaged structure according to claim 7, wherein said plurality of external connecting terminals is a lead frame which includes an inner lead and an outer lead.