# US 2014/0197510 A1 · Conversion structure, image sensor assembly and method for fabricating conversion structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197510 A1 - Document ID: US20140197510A1 - Status: Published application - Kind: A1 - Application number: 13/861,406 - Filed: 2013-04-12 - Published: 2014-07-17 - Earliest claimed: 2013-01-15 - Assignees: Architek Material Co., Ltd. - Applicants: Architek Material Co., Ltd. - Inventors: Shu-Lin Ho; Pao-Yun Tang; Kei-Hsiung Yang - Web page: https://patentgrep.com/patent/US20140197510A1 ## CPC - H10F 30/301: {the devices being sensitive to very short wavelength, e.g. being sensitive to X-rays, gamma-rays or corpuscular radiation} - G01T 1/2002: {Optical details, e.g. reflecting or diffusing layers} - H10F 77/496: {Luminescent members, e.g. fluorescent sheets (wavelength conversion means for photovoltaic cells H10F77/45)} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G01T: MEASUREMENT OF NUCLEAR OR X-RADIATION (radiation analysis of materials, mass spectrometry G01N23/00; tubes for determining the presence, intensity, density or energy of radiation or particles H01J47/00) ## Abstract An electromagnetic wave conversion structure consists of a substrate, a plurality of electromagnetic wave conversion units forming a two-dimensional array, a reflective film and a plurality of reflective layers. The substrate has a first surface and a second surface disposed opposite to the first surface. The second surface consists of a plurality of trenches formed in the body of the substrate. Each electromagnetic wave conversion units is disposed in each trench, is used to absorb first electromagnetic waves with a first wavelength and is used to emit second electromagnetic waves with a second wavelength. The first wavelength is shorter than the second wavelength. The reflective film covers the first surface of the substrate and is used to reflect the second electromagnetic wave. Each of the reflective layers is disposed on the sidewall of each trench of the corresponding electromagnetic wave conversion unit. ## Claims ### Claim 1 A conversion structure, comprising: a substrate, having a first surface and a second surface opposite to the first surface, wherein the second surface of the substrate having a plurality of trenches penetrating the substrate; a plurality of electromagnetic wave conversion elements, respectively disposed in each of the trenches, wherein each of the electromagnetic wave conversion elements is used to absorb a first electromagnetic wave having a first electromagnetic wave wavelength and to emit a second electromagnetic wave having a second electromagnetic wave wavelength, and the first electromagnetic wave wavelength is shorter than the second electromagnetic wave wavelength; a reflective film, covering the first surface of the substrate, wherein the first electromagnetic wave penetrates the reflective film, and the reflective film is used to reflect the second electromagnetic wave; and a plurality of reflective layers, respectively disposed between a sidewall of each of the trenches and each of the electromagnetic wave conversion elements, wherein the reflective layers are used to reflect the second electromagnetic wave. ### Claim 2 (depends on 1) The conversion structure of claim 1, wherein each of the trenches does not penetrate the substrate. ### Claim 3 (depends on 1) The conversion structure of claim 1, wherein the trenches are arranged in an array layout. ### Claim 4 (depends on 1) The conversion structure of claim 1, wherein each of the trenches has an opening shape on the second surface, and each of the opening shapes is circular, elliptical, or polygonal. ### Claim 5 (depends on 1) The conversion structure of claim 1, wherein the sidewall of each of the trenches is not perpendicular to the second surface. ### Claim 6 (depends on 1) The conversion structure of claim 1, wherein each of the trenches comprises a first opening located on the second surface and a second opening located on the first surface, wherein an opening area of each of the first openings is larger than an opening area of each of the second openings. ### Claim 7 (depends on 1) The conversion structure of claim 1, wherein one of the electromagnetic wave conversion elements comprises a scintillator, a phosphorescent material, or a luminescent material. ### Claim 8 (depends on 7) The conversion structure of claim 7, wherein one of the electromagnetic wave conversion elements is a mixture or a compound of materials comprising a scintillator, phosphorescent material, or luminescent material. ### Claim 9 An image sensor assembly, comprising: a conversion structure, comprising: a first substrate, having a first surface and a second surface opposite to the first surface, wherein the second surface of the substrate has a plurality of trenches penetrating the substrate; a plurality of electromagnetic wave conversion elements, respectively disposed in each of the trenches, wherein each of the electromagnetic wave conversion elements is used to absorb a first electromagnetic wave having a first electromagnetic wave wavelength and to emit a second electromagnetic wave having a second electromagnetic wave wavelength, and the first electromagnetic wave wavelength is shorter than the second electromagnetic wave wavelength; a reflective film, covering on the first surface of the substrate, wherein the first electromagnetic wave penetrates the reflective film, and the reflective film is used to reflect the second electromagnetic wave; and a plurality of reflective layers, respectively disposed between a sidewall of each of the trenches and each of the electromagnetic wave conversion elements, wherein the reflective layers are used to reflect the second electromagnetic waves; and a light sensor assembly, disposed opposite to the second surface of the first substrate and comprising a plurality of sensing regions, the light sensor assembly comprising: a second substrate; and a plurality of light sensor devices, respectively disposed within each of the sensing regions on the second substrate. ### Claim 10 (depends on 9) The image sensor assembly of claim 9, wherein the light sensor assembly further comprises a plurality of switching devices respectively electrically connected to each of the light sensor devices. ### Claim 11 (depends on 9) The image sensor assembly of claim 9, wherein each of the light sensing regions is corresponding to at least one of the trenches. ### Claim 12 (depends on 9) The image sensor assembly of claim 9, wherein the trenches are arranged in an array layout. ### Claim 13 A method of fabrication a conversion structure, comprising: providing a substrate having a first surface and a second surface opposite to the first surface; forming a plurality of trenches penetrating the substrate on the second surface; depositing a reflective film on the first surface of the substrate; forming a reflective layer on a sidewall of each of the trenches; and filling an electromagnetic wave conversion element into each of the trenches, wherein each of the electromagnetic wave conversion elements is used to absorb a first electromagnetic wave having a first electromagnetic wave wavelength and to emit a second electromagnetic wave having a second electromagnetic wave wavelength, and the first electromagnetic wave wavelength is shorter than the second electromagnetic wave wavelength. ### Claim 14 (depends on 13) The method of claim 13, wherein the trenches do not penetrate the substrate.