# US 2014/0197506 A1 · Semiconductor device and method of manufacturing semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197506 A1 - Document ID: US20140197506A1 - Status: Published application - Kind: A1 - Application number: 14/151,028 - Filed: 2014-01-09 - Published: 2014-07-17 - Earliest claimed: 2013-01-17 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Tsuyoshi Watanabe - Web page: https://patentgrep.com/patent/US20140197506A1 ## CPC - H10F 39/804: {Containers or encapsulations} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes: an organic substrate; an integrated circuit and a chip part provided on the organic substrate; a molded section including a central portion and a peripheral portion, and forming, as a whole, a concave shape, the central portion sealing the integrated circuit and the chip part on the organic substrate, and the peripheral portion standing around the central portion; and a solid-state image pickup element provided on the central portion of the molded section, the solid-state image pickup element having a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section. ## Claims ### Claim 1 A semiconductor device comprising: an organic substrate; an integrated circuit and a chip part provided on the organic substrate; a molded section including a central portion and a peripheral portion, and forming, as a whole, a concave shape, the central portion sealing the integrated circuit and the chip part on the organic substrate, and the peripheral portion standing around the central portion; and a solid-state image pickup element provided on the central portion of the molded section, the solid-state image pickup element having a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the central portion of the molded section is connected to the peripheral portion of the molded section to allow heat generated from the integrated circuit to be transferred from the central portion of the molded section to the peripheral portion of the molded section. ### Claim 3 (depends on 2) The semiconductor device according to claim 2, wherein the central portion of the molded section is connected to the peripheral portion of the molded section at two points that are located symmetrically with respect to a central position of the organic substrate. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein the molded section is made of mold resin having high heat conductivity, and allowing heat generated from the integrated circuit to be easily transferred from the central portion of the molded section to the peripheral portion of the molded section. ### Claim 5 (depends on 4) The semiconductor device according to claim 4, wherein the mold resin includes one of liquid crystal polymer and epoxy-based thermosetting resin containing filler. ### Claim 6 (depends on 1) The semiconductor device according to claim 1, further comprising a glass section to be bonded to the top edge, as a whole, of the peripheral portion, wherein the molded section with the concave shape and the glass section form a cavity structure that contains the solid-state image pickup element. ### Claim 7 (depends on 1) The semiconductor device according to claim 1, wherein the molded section further includes a step portion along the peripheral portion, the step portion having a top edge that is, in position in the thickness direction, higher than the top edge of the central portion and lower than the top edge of the peripheral portion, the solid-state image pickup element has a peripheral portion that is in contact with the top edge of the step portion, and a central portion that is away from the molded section, and an air layer is formed between the molded section and the solid-state image pickup element. ### Claim 8 (depends on 1) The semiconductor device according to claim 1, wherein the molded section includes an air hole running through between the integrated circuit and the solid-state image pickup element. ### Claim 9 (depends on 1) The semiconductor device according to claim 1, wherein the molded section includes a heat radiation fin in an outer portion of the peripheral section. ### Claim 10 (depends on 1) The semiconductor device according to claim 1, wherein the integrated circuit is a chip size package (CSP), is soldered to the organic substrate, and is sealed together with the chip part by the molded section. ### Claim 11 A method of manufacturing a semiconductor device, the method comprising: providing an organic substrate; providing an integrated circuit and a chip part on the organic substrate; forming a molded section including a central portion and a peripheral portion, and forming, as a whole, a concave shape, the central portion sealing the integrated circuit and the chip part on the organic substrate, and the peripheral portion standing around the central portion; and providing a solid-state image pickup element on the central portion of the molded section, the solid-state image pickup element having a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section.