# US 2014/0197501 A1 · MEMS Device with Polymer Layer, System of a MEMS Device with a Polymer Layer, Method of Making a MEMS Device with a Polymer Layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197501 A1 - Document ID: US20140197501A1 - Status: Published application - Kind: A1 - Application number: 13/743,300 - Filed: 2013-01-16 - Published: 2014-07-17 - Earliest claimed: 2013-01-16 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Alfons Dehe - Web page: https://patentgrep.com/patent/US20140197501A1 ## CPC - B81C 1/00325: {for reducing stress inside of the package structure} - B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers} - B81C 1/00158: {Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039)} - B81C 1/00182: {Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer} - B81B 2201/0257: Microphones or microspeakers - B81C 2201/013: Etching - B81C 2201/0159: Lithographic techniques not provided for in B81C2201/0157 - B81C 2201/0198: for making a masking layer - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer. ## Claims ### Claim 1 A MEMS device comprising: a first polymer layer; a substrate disposed on the first polymer layer; a MEMS structure supported by the substrate; a first opening disposed in the substrate; and a second opening disposed in the first polymer layer. ### Claim 2 (depends on 1) The MEMS device according to claim 1, wherein the first polymer layer further comprises small openings, the small openings being smaller than the second opening and connecting the second opening to a surface of the first polymer layer. ### Claim 3 (depends on 1) The MEMS device according to claim 1, wherein the first polymer layer further comprises plugs, the plugs disposed between the second opening and a surface of the first polymer layer. ### Claim 4 (depends on 1) The MEMS device according to claim 1, wherein the second opening is larger than the first opening. ### Claim 5 (depends on 1) The MEMS device according to claim 1, further comprising a first ventilation outlet disposed in the first polymer layer; and a ventilation channel connecting the second opening with the first ventilation outlet. ### Claim 6 (depends on 5) The MEMS device according to claim 5, wherein the ventilation channel winds around the second opening. ### Claim 7 (depends on 1) The MEMS device according to claim 1, further comprising a second polymer layer, the second polymer layer disposed between the first polymer layer and the substrate, wherein the second polymer layer comprises a third opening, the third opening connecting the first opening with the second opening. ### Claim 8 (depends on 7) The MEMS device according to claim 7, wherein the second polymer layer comprises a second ventilation outlet, wherein the second ventilation outlet is connected to the first opening via an overpressure valve. ### Claim 9 A system comprising: a carrier; an aperture disposed in the carrier; a MEMS device disposed on the aperture; and a cap covering the MEMS device, wherein the MEMS device comprises a perforation in a first polymer layer, the perforation overlying the aperture. ### Claim 10 (depends on 9) The system according to claim 9, wherein the aperture is a sound port and wherein the MEMS device is a semiconductor microphone. ### Claim 11 (depends on 9) The system according to claim 9, further comprising an integrated circuit chip disposed on the carrier, the integrated circuit chip being electrically connected to the MEMS device and enclosed by the cap. ### Claim 12 (depends on 9) The system according to claim 9, wherein the MEMS device comprises a second polymer layer. ### Claim 13 (depends on 9) The system according to claim 9, wherein the MEMS device comprises a substrate, wherein the substrate comprising a first opening, wherein the first polymer layer comprises a second opening, wherein the first opening is connected to the second opening, and wherein the second opening is connected to the perforation. ### Claim 14 (depends on 9) The system according to claim 9, wherein the first polymer layer comprises a negative photoresist layer. ### Claim 15 A system comprising: a carrier; a MEMS device disposed on the carrier, the MEMS device comprising a first polymer layer; and a cap covering the MEMS device. ### Claim 16 (depends on 15) The system according to claim 15, wherein the MEMS device comprises a semiconductor substrate, the semiconductor substrate comprising a first opening, and wherein the first polymer layer comprises a second opening. ### Claim 17 (depends on 16) The system according to claim 16, wherein the second opening is larger than the first opening. ### Claim 18 (depends on 15) The system according to claim 15, wherein an aperture is disposed on a top surface of the cap. ### Claim 19 (depends on 15) The system according to claim 15, further an aperture is disposed on a sidewall of the cap. ### Claim at position 20 20-25. (canceled) ### Claim 26 A MEMS device comprising: a first polymer layer; a semiconductor substrate disposed on the first polymer layer; a MEMS structure supported by the semiconductor substrate; a first opening disposed in the semiconductor substrate; and a second opening disposed in the first polymer layer. ### Claim 27 (depends on 26) The MEMS device according to claim 26, wherein the MEMS structure comprises a membrane, a back plate and a spacer between the membrane and the back plate. ### Claim 28 (depends on 26) The MEMS device according to claim 26, wherein the MEMS structure and the first polymer layer are disposed on opposite sides of the semiconductor substrate. ### Claim 29 (depends on 26) The MEMS device according to claim 26, wherein the first polymer layer comprises a photo structurable polymer layer. ### Claim 30 (depends on 26) The MEMS device according to claim 26, wherein the first polymer layer comprises a thickness of about 50 μm to about 300 μm. ### Claim 31 (depends on 26) The MEMS device according to claim 26, wherein the first and second openings comprise a diameter of about 50 to about 100 μm.