# US 2014/0197444 A1 · Light emitting element, backlight module, liquid crystal display device

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- Number: US 2014/0197444 A1
- Document ID: US20140197444A1
- Status: Published application
- Kind: A1
- Application number: 14/093,789
- Filed: 2013-12-02
- Published: 2014-07-17
- Earliest claimed: 2013-01-16
- Assignees: Beijing Boe Optoelectronics Technology Co., Ltd.
- Applicants: Beijing Boe Optoelectronics Technology Co., Ltd.
- Inventors: YUEFENG SU; HAIWEI SUN; JINGSHI LI
- Web page: https://patentgrep.com/patent/US20140197444A1

## CPC

- H10H 20/8586: {comprising fluids, e.g. heat-pipes}
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A light emitting element comprises: a printed circuit board, a chip disposed on a first face of the printed circuit board, a first encapsulation body and a second encapsulation body. The first encapsulation body covers the chip, and the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board. A first pipe and a second pipe are extended respectively from two positions of the first encapsulation body and are respectively connected to two positions of the second encapsulation body. Fluid is encapsulated within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe.

## Claims

### Claim 1

A light emitting element, comprising:
a printed circuit board;
a chip disposed on a first face of the printed circuit board; and
a first encapsulation body and a second encapsulation body;
wherein the first encapsulation body covers the chip, the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board, a first pipe and a second pipe are extended respectively from two positions of the first encapsulation body and are respectively connected to two positions of the second encapsulation body, and fluid is encapsulated within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe.

### Claim 2 (depends on 1)

The light emitting element according to claim 1, wherein the fluid contains fluorescent powders and heat conducting liquid in which the fluorescent powders are uniformly dispersed

### Claim 3 (depends on 2)

The light emitting element according to claim 2, wherein the surfaces of the chip may be coated with a transparent protective layer.

### Claim 4 (depends on 1)

The light emitting element according to claim 1, further comprising one-way valves disposed in the first pipe and the second pipe.

### Claim 5 (depends on 1)

The light emitting element according to claim 1, wherein the first encapsulation body comprises a first jacket surrounding the chip, a first piston closing the first jacket and capable of moving against the inner wall of the first jacket, and fluid encapsulated within the first jacket.

### Claim 6 (depends on 1)

The light emitting element according to claim 1, wherein the second encapsulation body comprises a second jacket surrounding a second face of the printed circuit board or a part of the second face of the printed circuit board, a second piston closing the second jacket and capable of moving against the inner wall of the second jacket, and fluid encapsulated within the second jacket.

### Claim 7 (depends on 1)

The light emitting element according to claim 1, further comprising a heat dissipating member disposed on the second encapsulation body.

### Claim 8 (depends on 1)

A backlight module, comprising a light emitting element according to claim 1.

### Claim 9 (depends on 8)

A light crystal display device, comprising a backlight module according to claim 8.