# US 2014/0197443 A1 · Led device having improved luminous efficacy > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197443 A1 - Document ID: US20140197443A1 - Status: Published application - Kind: A1 - Application number: 14/238,963 - Filed: 2011-08-16 - Published: 2014-07-17 - Earliest claimed: 2011-08-16 - Assignees: Samsung Electronics Co., Ltd. - Inventors: Kyung Mi Moon; Jung Hye Chae; Hyung Kun Kim; Se Hwan An - Web page: https://patentgrep.com/patent/US20140197443A1 ## CPC - H10H 20/8512: {Wavelength conversion materials} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K. ## Claims ### Claim 1 A light emitting diode (LED) device comprising: an LED chip emitting light within a specific wavelength region; a transparent resin layer covering a light emission surface of the LED chip; and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K. ### Claim 2 (depends on 1) The LED device of claim 1, wherein the mean free path ranges from 0.8 mm to 1.05 mm at the temperature of 5500 K. ### Claim 3 (depends on 1) The LED device of claim 1, wherein a volume of the color conversion is 5 or more times that of the transparent resin layer. ### Claim 4 (depends on 1) The LED device of claim 1, wherein the volume of the color conversion layer ranges from 5 or more times and 15 or less times the volume of the transparent resin layer. ### Claim 5 (canceled) ### Claim 6 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has an upwardly convex upper surface, and a curvature of the upper surface of the transparent resin layer is 0.5 mm−1 or greater in a central portion thereof. ### Claim 7 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has an upwardly convex upper surface, and a curvature of the upper surface of the transparent resin layer ranges from 0.5 mm−1 to 2 mm−1 in a central portion thereof. ### Claim 8 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has a thickness equal to three or more times that of the LED chip, from an upper surface of the LED chip. ### Claim 9 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has a thickness ranging from three times to 10 times that of the LED chip, from an upper surface of the LED chip. ### Claim 10 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has a refractive index of 1.4 or more. ### Claim 11 (depends on 1) The LED device of claim 1, wherein the transparent resin layer has a refractive index of 1.4 to 2.2. ### Claim 12 (depends on 1) The LED device of claim 1, wherein the LED device further comprises a package body including a reflective cup disposed therein containing the LED chip mounted therein, and the transparent resin layer and the color conversion layer are disposed in the reflective cup. ### Claim 13 (depends on 12) The LED device of claim 12, wherein an inner surface of the reflective cup includes a stepped portion formed therein, and an interface between the transparent resin layer and the color conversion layer contacts the inner surface of the reflective cup at the stepped portion. ### Claim 14 (depends on 1) The LED device of claim 1, wherein the LED device further comprises a substrate including the LED chip mounted thereon, the transparent resin layer covers the LED chip on the substrate, and the color conversion layer covers the transparent resin layer on the substrate. ### Claim 15 (canceled) ### Claim 16 (depends on 1) The LED device of claim 1, wherein the LED chip is a blue LED chip and the color conversion layer includes a yellow phosphor. ### Claim 17 (depends on 16) The LED device of claim 16, wherein the color conversion layer further comprises a green phosphor and a red phosphor. ### Claim 18 (depends on 17) The LED device of claim 17, wherein the color conversion layer includes the red phosphor layer covering the transparent resin layer, and a mixed phosphor layer including the green phosphor and the yellow phosphor covering the red phosphor layer. ### Claim 19 (depends on 1) The LED device of claim 1, wherein the LED chip is the blue LED chip and the color conversion layer includes a red phosphor and a green phosphor. ### Claim 20 (depends on 19) The LED device of claim 19, wherein the color conversion layer includes the red phosphor layer covering the transparent resin layer and a green phosphor layer covering the red phosphor layer. ### Claim 21 (depends on 1) The LED device of claim 1, wherein the LED chip is an ultraviolet LED chip and the color conversion layer includes a red phosphor, a green phosphor and a blue phosphor. ### Claim 22 (depends on 21) The LED device of claim 21, wherein the color conversion layer includes the red phosphor layer covering the transparent resin layer, the green phosphor layer covering the red phosphor layer, and a blue phosphor layer covering the green phosphor layer.