# US 2014/0197440 A1 · Illumination device

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- Number: US 2014/0197440 A1
- Document ID: US20140197440A1
- Status: Published application
- Kind: A1
- Application number: 14/218,869
- Filed: 2014-03-18
- Published: 2014-07-17
- Earliest claimed: 2012-05-29
- Assignees: Formosa Epitaxy Incorporation
- Applicants: Formosa Epitaxy Incorporation
- Inventors: Zhi-Ting Ye; Fen-Ren Chien; Shyi-Ming Pan
- Web page: https://patentgrep.com/patent/US20140197440A1

## CPC

- F21V 21/14: Adjustable mountings
- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F21V 3/02: characterised by the shape
- F21V 17/10: characterised by specific fastening means or way of fastening (F21V17/02 - F21V17/08 take precedence)
- F21V 21/00: Supporting, suspending, or attaching arrangements for lighting devices (F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00); Hand grips
- F21V 23/06: the elements being coupling devices {, e.g. connectors}
- F21V 29/85: characterised by the material (liquid coolants F21V29/56)
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8506: {Containers}
- H10H 20/851: Wavelength conversion means
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- F21Y 2107/00: Light sources with three-dimensionally disposed light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/01335: {the light-emitting regions comprising nitride materials}
- H10W 72/01515: {Forming coatings}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/075: {of bond wires}
- H10W 72/07554: {changes in dispositions}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/237: {Multiple bump connectors having different shapes}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/931: {Shapes of bond pads}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) structures. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.

## Claims

### Claim 1

An illumination device, comprising:
at least one light emitting element, comprising:
a transparent substrate, having a support surface and a second main surface disposed opposite to each other; and
a plurality of light emitting diode (LED) structures, wherein at least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with at least a part of the support surface without the LED structures, wherein light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface; and
a supporting base; and
at least one support, coupled to the supporting base;
wherein the light emitting element is disposed on the support, and at least apart of the support is inclined inward or outward relative to the central axis of supporting base.

### Claim 2 (depends on 1)

The illumination device of claim 1, wherein a first angle exists between the light emitting element and the supporting base, and the first angle ranges from 45 degrees to 75 degrees.

### Claim 3 (depends on 1)

The illumination device of claim 1, wherein the support comprises a first connected portion and a second connected portion, the second connected portion is disposed on the supporting base, the first connected portion is rotatably connected to the second connected portion, wherein a second angle exists between the first connected portion and the second connected portion.

### Claim 4 (depends on 3)

The illumination device of claim 3, wherein the first connected portion extends outward relative to a central axis of the supporting base and the second angle ranges from 135 degrees to 175 degrees.

### Claim 5 (depends on 3)

The illumination device of claim 3, wherein the first connected portion extends inward relative to a central axis of the supporting base and the second angle ranges from 5 degrees to 45 degrees.

### Claim 6 (depends on 3)

The illumination device of claim 3, wherein a third angle exists between the second connected portion and the supporting base and the third angle ranges from 45 degrees to 85 degrees.

### Claim 7 (depends on 1)

The illumination device of claim 1, wherein the support is an arc-shaped structure.

### Claim 8 (depends on 7)

The illumination device of claim 7, wherein a radius of the arc-shaped support ranges from 10 mm to 200 mm, a center of the arc-shaped structure is near to or away from a central axis of the supporting base.

### Claim 9 (depends on 1)

The illumination device of claim 1, wherein the support is a parabolic structure or an ellipse-shaped structure.