# US 2014/0197436 A1 · Light emitting device and light emitting device package

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- Number: US 2014/0197436 A1
- Document ID: US20140197436A1
- Status: Published application
- Kind: A1
- Application number: 14/149,117
- Filed: 2014-01-07
- Published: 2014-07-17
- Earliest claimed: 2013-01-11
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Jung Hoon KIM
- Web page: https://patentgrep.com/patent/US20140197436A1

## CPC

- H10H 20/856: Reflecting means
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

According to example embodiments, a light emitting device package includes a package body including nanofibers and light-reflective particles dispersed in a resin, first and second electrodes in the package body, and a light emitting device on the package body. The emitting device is electrically connected to the first and second electrodes.

## Claims

### Claim 1

A light emitting device package comprising:
a package body including nanofibers and light-reflective particles dispersed in a resin;
first and second electrodes in the package body; and
a light emitting device on the package body,
the light emitting device being electrically connected to the first and second electrodes.

### Claim 2 (depends on 1)

The light emitting device package of claim 1, wherein the resin includes one of epoxy, silicone, modified silicone, a urethane resin, an oxetane resin, acryl, polycarbonate, polyimide, and any combination thereof.

### Claim 3 (depends on 1)

The light emitting device package of claim 1, wherein the nanofibers include at least one of chitin and cellulose.

### Claim 4 (depends on 1)

The light emitting device package of claim 1, wherein a width of the nanofibers is equal to or less than about 80 nm.

### Claim 5 (depends on 1)

The light emitting device package of claim 1, wherein a length of the nanofibers is equal to or greater than about 1 μm.

### Claim 6 (depends on 1)

The light emitting device package of claim 1, wherein a weight ratio of the nanofibers to the resin ranges from 1% to about 5%.

### Claim 7 (depends on 1)

The light emitting device package of claim 1, wherein a coefficient of thermal expansion of the package body ranges from about 4 ppm/K to 10 ppm/K at a temperature ranging from about 20° C. to about 150° C.

### Claim 8 (depends on 1)

The light emitting device package of claim 1, wherein a weight ratio of the light-reflective particles to the resin ranges from about 20% to about 80%.

### Claim 9

A light emitting device comprising:
a light emitting laminate including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on each other,
the active layer between the first and second conductive-type semiconductor layers; and
a wavelength conversion layer on the light emitting laminate,
the wavelength conversion layer including nanofibers and a wavelength conversion material dispersed in a light-transmissive resin.

### Claim 10 (depends on 9)

The light emitting device of claim 9, wherein the nanofibers include at least one of chitin and cellulose.

### Claim 11 (depends on 9)

The light emitting device of claim 9, wherein a weight ratio of the nanofibers to the resin ranges from 0.1% to less than 1%.

### Claim 12 (depends on 9)

The light emitting device of claim 9, wherein one surface of the wavelength conversion layer contacts the light emitting laminate.

### Claim 13 (depends on 9)

The light emitting device of claim 9, wherein the wavelength conversion layer directly contacts a light emitting surface of the light emitting laminate.

### Claim 14 (depends on 9)

The light emitting device of claim 9, wherein a thickness of the wavelength conversion layer ranges from about 20 μm to about 200 μm.

### Claim 15 (depends on 9)

The light emitting device of claim 9, wherein a weight ratio of the wavelength conversion material to the resin ranges from about 50% to about 300%.

### Claim 16

A light emitting device comprising:
a light emitting laminate; and
a wavelength conversion layer on the light emitting laminate,
the wavelength conversion layer including nanofibers and a wavelength conversion material dispersed in a light-transmissive resin.

### Claim 17 (depends on 16)

The light emitting device of claim 16, wherein at least some of the nanofibers are spaced apart from at least some of the wavelength conversion material.

### Claim 18 (depends on 16)

The light emitting device of claim 16, wherein
a width of the nanofibers is less than or equal to 80 nm,
the nanofibers include at least one of chitin and cellulose,

### Claim 19 (depends on 16)

A light emitting device package comprising:
a package body including fibers and light-reflective particles dispersed in a resin material; and
the light-emitting device of claim 16 on the package body.

### Claim 20 (depends on 19)

The light emitting device package of claim 19, wherein
the fibers include at least one of chitin and cellulose, and
a width of the fibers is less than or equal to 80 nm.