# US 2014/0197433 A1 · Light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197433 A1 - Document ID: US20140197433A1 - Status: Published application - Kind: A1 - Application number: 14/217,701 - Filed: 2014-03-18 - Published: 2014-07-17 - Earliest claimed: 2010-01-22 - Assignees: Sharp Kabushiki Kaisha - Applicants: Sharp Kabushiki Kaisha - Inventors: Shinya ISHIZAKI; Makoto AGATANI; Tomokazu NADA; Toshio HATA - Web page: https://patentgrep.com/patent/US20140197433A1 ## CPC - H10W 90/00: Package configurations - F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb - F21K 9/238: Arrangement or mounting of circuit elements integrated in the light source - F21V 3/00: Globes; Bowls; Cover glasses (with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506) - F21V 5/048: {the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses} - F21V 5/10: comprising photoluminescent material - F21V 29/74: with fins or blades - H10H 20/831: characterised by their shape - H10H 20/8506: {Containers} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/852: Encapsulations - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/10: Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/851: Wavelength conversion means - H10W 90/753: {between laterally-adjacent chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency. ## Claims ### Claim at position 1 1-9. (canceled) ### Claim 10 A light emitting device comprising: a substrate; a plurality of LED chips positioned around a center of a primary surface of the substrate; a resin frame made of resin that has light reflectivity, formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which said plurality of LED chips are provided; an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device, the anode-side electrode land and the cathode-side electrode land being provided outside said resin frame and near peripheral end of the primary surface of the substrate; an electrode wiring pattern formed on the primary surface of said substrate including (i) an anode pattern extending from said anode-side electrode land to a portion under said resin frame and (ii) a cathode pattern extending from said cathode-side electrode land to the other portion under said resin frame, so as to electrically connect the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land; and a plurality of first wires for connecting the LED chips among said plurality of LED chips to the electrode wiring pattern, a portion of each of the plurality of first wires that is contacted with the electrode wiring pattern being covered by said resin frame. ### Claim 11 (depends on 10) The light emitting device of claim 10, wherein said substrate has a rectangular outer shape in a top view. ### Claim 12 (depends on 11) The light emitting device as set forth in claim 11, wherein the cathode-side electrode land is provided near a corner of the primary surface of the substrate, and the corner is diagonally opposite a corner where the anode-side electrode land is provided. ### Claim 13 (depends on 11) The light emitting device as set forth in claim 11, wherein the anode-side electrode land and the cathode-side electrode land are disposed diagonally on the primary surface of the substrate. ### Claim 14 (depends on 10) The light emitting device as set forth in claim 10, further comprising: a plurality of second wires for electrically connecting the plurality of LED chips with each other, and a fluorescent-material-containing resin layer provided attaching to an inner side of the resin frame and covering the plurality of LED chips and the second wires. ### Claim 15 (depends on 14) The light emitting device as set forth in claim 14, wherein the fluorescent-material-containing resin layer is provided along a shape of the resin frame so as to have a circular shape in the top view. ### Claim 16 (depends on 10) The light emitting device of claim 10, wherein each of said anode-side electrode land and said cathode-side electrode land has a width larger than that of said electrode wiring pattern. ### Claim 17 (depends on 10) The light emitting device of claim 10, wherein said substrate comprises ceramic, and said plurality of LED chips are attached to the primary surface of said substrate via a resin adhesive agent comprising silicone. ### Claim 18 (depends on 10) The light emitting device of claim 10, further comprising protection films provided on the anode and cathode patterns. ### Claim 19 (depends on 10) The light emitting device of claim 10, wherein said anode pattern further extends to the mounting area. ### Claim 20 (depends on 10) The light emitting device of claim 10, wherein said cathode pattern further extends to the mounting area. ### Claim 21 A light emitting device comprising: a substrate; a plurality of LED chips positioned around a center of a primary surface of the substrate; a resin frame made of resin that has light reflectivity, formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which said plurality of LED chips are provided; an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device, the anode-side electrode land and the cathode-side electrode land being provided outside said resin frame and near peripheral end of the primary surface of the substrate; an electrode wiring pattern formed on the primary surface of said substrate including (i) a first anode pattern provided on a portion under said resin frame and (ii) a first cathode pattern provided on the other portion under said resin frame, the first anode pattern and the first cathode pattern electrically connecting the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land; a plurality of first wires for connecting first chips among the plurality of LED chips to the first anode pattern, a portion of each of the plurality of first wires that is contacted with the first anode pattern being covered by the resin frame; and a plurality of second wires for connecting second chips among the plurality of LED chips to the first cathode pattern, a portion of each of the plurality of second wires that is contacted with the first cathode pattern being covered by the resin frame. ### Claim 22 (depends on 21) The light emitting device as set forth in claim 21, wherein said substrate has a rectangular outer shape in a top view. ### Claim 23 (depends on 22) The light emitting device as set forth in claim 22, wherein the cathode-side electrode land is provided near a corner of the primary surface of the substrate, and the corner is diagonally opposite a corner where the anode-side electrode land is provided. ### Claim 24 (depends on 22) The light emitting device as set forth in claim 22, wherein the anode-side electrode land and the cathode-side electrode land are disposed diagonally on the primary surface of the substrate. ### Claim 25 (depends on 21) The light emitting device as set forth in claim 21, further comprising: a plurality of third wires for electrically connecting the plurality of LED chips with each other, and a fluorescent-material-containing resin layer provided attaching to an inner side of the resin frame and covering the plurality of LED chips and the third wires. ### Claim 26 (depends on 25) The light emitting device as set forth in claim 25, wherein the fluorescent-material-containing resin layer is provided along a shape of the resin frame so as to have a circular shape in the top view. ### Claim 27 (depends on 21) The light emitting device of claim 21, wherein said anode-side electrode land has a width larger than that of the first anode pattern, and said cathode-side electrode land has a width larger than that of the first cathode pattern. ### Claim 28 (depends on 21) The light emitting device of claim 21, wherein said substrate comprises ceramic, and said plurality of LED chips are attached to the primary surface of said substrate via a resin adhesive agent comprising silicone. ### Claim 29 (depends on 21) The light emitting device of claim 21, wherein the electrode wiring pattern further includes (iii) a second anode pattern connected between said anode-side electrode land and the first anode pattern and (iv) a second cathode pattern connected between said cathode-side electrode land and the first cathode pattern. ### Claim 30 (depends on 29) The light emitting device of claim 29, further comprising protection films provided on the second anode and cathode patterns.