# US 2014/0197367 A1 · Broadening of Percolation Slope in Conductive Carbon Black Compositions with at least One Non-Conductive Polymer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197367 A1 - Document ID: US20140197367A1 - Status: Published application - Kind: A1 - Application number: 13/740,092 - Filed: 2013-01-11 - Published: 2014-07-17 - Earliest claimed: 2013-01-11 - Assignees: Sabic Innovative Plastics IP B.V. - Applicants: Sabic Innovative Plastics IP B.V. - Inventors: Anton Kumanan; Reema Sinha; Susanta Mitra; Uchiyama Tatsuya - Web page: https://patentgrep.com/patent/US20140197367A1 ## CPC - H01B 1/04: mainly consisting of carbon-silicon compounds, carbon or silicon - C08K 3/04: Carbon - C08L 23/06: Polyethylene - C08L 25/12: with unsaturated nitriles - C08L 67/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) - C08L 69/00: Compositions of polycarbonates; Compositions of derivatives of polycarbonates - H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon - C08L 2207/068: Ultra high molecular weight polyethylene - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed compositions comprise a thermoplastic resin phase and a filler composition comprising a conductive carbon black and a non-conductive polymer, dispersed within the thermoplastic resin phase. Also disclosed are methods for the manufacture of the disclosed composites and articles of manufacture comprising same. ## Claims ### Claim 1 An electrostatic dissipative composite, comprising a) a continuous thermoplastic polymer phase; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. a conductive carbon black; and ii. a non-conductive polymer; wherein the filler composition is present in a volume percentage loading in the range of from 7.4 to 10.5 relative to a total volume of the composite; and wherein the composite exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 2 (depends on 1) The electrostatic dissipative composite of claim 1, wherein the continuous thermoplastic polymer phase comprises at least one polycarbonate. ### Claim 3 (depends on 2) The electrostatic dissipative composite of claim 2, wherein at least one polycarbonate is a bisphenol A polycarbonate. ### Claim 4 (depends on 1) The electrostatic dissipative composite of claim 1, wherein at least one non-conductive polymer is selected from the group consisting of styrene-acrylonitrile copolymer and ultra-high molecular weight polyethylene. ### Claim 5 (depends on 4) The electrostatic dissipative composite of claim 4, wherein the ultra-high molecular weight polyethylene is MIPELON XM 221U. ### Claim 6 (depends on 4) The electrostatic dissipative composite of claim 4, wherein the styrene-acrylonitrile copolymer is a styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene. ### Claim 7 (depends on 1) The electrostatic dissipative composite of claim 1, wherein the conductive carbon black is ENSACO 250G. ### Claim 8 (depends on 1) The electrostatic dissipative composite of claim 1, wherein the non-conductive polymer is present in an amount in the range of from 15 to 25 weight % relative to the total filler loading. ### Claim 9 An electrostatic dissipative composite, comprising a) a crystalline continuous thermoplastic polymer phase; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. a conductive carbon black; and ii. a non-conductive polymer; wherein the filler composition is present in a volume percentage loading in the range of from 5.0 to 6.0 relative to a total volume of the composite; and wherein the composite exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 10 (depends on 9) The electrostatic dissipative composite of claim 9, wherein the continuous thermoplastic polymer phase comprises polybutylene terephthalate. ### Claim 11 (depends on 9) The electrostatic dissipative composite of claim 9, wherein the conductive carbon black is ENSACO 250 G and the at least one non-conductive polymer is MIPELON XM 221 U. ### Claim 12 (depends on 9) The electrostatic dissipative composite of claim 9, wherein the total amount of non-conductive polymer ranges from 15 to 25 weight % of the total filler loading. ### Claim 13 An electrostatic dissipative composite, comprising a) a continuous thermoplastic polymer phase; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. a conductive carbon black; and ii. a non-conductive polymer; wherein the composite exhibits a tolerance level in the range of from ±0.37 to ±1.0. ### Claim 14 (depends on 13) The electrostatic dissipative composite of claim 13, wherein the continuous thermoplastic polymer phase comprises at least one polymer selected from the group consisting of polycarbonate and polybutylene terephthalate. ### Claim 15 (depends on 14) The electrostatic dissipative composite of claim 14, wherein at least one polycarbonate is a bisphenol A polycarbonate. ### Claim 16 (depends on 13) The electrostatic dissipative composite of claim 13, wherein at least one non-conductive polymer is selected from the group consisting of styrene-acrylonitrile copolymer and ultra-high molecular weight polyethylene. ### Claim 17 (depends on 16) The electrostatic dissipative composite of claim 16, wherein the ultra-high molecular weight polyethylene is MIPELON XM 221U. ### Claim 18 (depends on 16) The electrostatic dissipative composite of claim 16, wherein the styrene-acrylonitrile copolymer is a styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene. ### Claim 19 (depends on 13) The electrostatic dissipative composite of claim 13, wherein the conductive carbon black is ENSACO 250G. ### Claim 20 (depends on 13) The electrostatic dissipative composite of claim 13, wherein the total amount of non-conductive polymer ranges from 15 to 25 weight % of the total filler loading. ### Claim 21 An electrostatic dissipative composite, comprising a) a continuous thermoplastic polymer phase comprising at least one bisphenol A polycarbonate; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. ENSACO 250G conductive carbon black; and ii. at least one non-conductive polymer selected from the group consisting of styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene and MIPELON XM 221U ultra-high molecular weight polyethylene; wherein the filler composition is present in a volume percentage loading in the range of from 7.4 to 10.5 relative to a total volume of the composite; wherein the non-conductive polymer is present in an amount in the range of from 15 to 25 weight % relative to the total filler loading; and wherein the composite exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 22 An electrostatic dissipative composite, comprising a) a crystalline continuous thermoplastic polymer phase comprising polybutylene terephthalate; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. ENSACO 250G conductive carbon black; and ii. MIPELON XM 221U ultra-high molecular weight polyethylene; wherein the filler composition is present in a volume percentage loading in the range of from 5.0 to 6.0 relative to a total volume of the composite; wherein the non-conductive polymer is present in an amount in the range of from 15 to 25 weight % relative to the total filler loading; and wherein the composition exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 23 An electrostatic dissipative composite, comprising a) a continuous thermoplastic polymer phase comprising at least one polymer selected from the group consisting of polybutylene terephthalate and polycarbonate; and b) at least one dispersed filler phase comprised of a filler composition, comprising i. ENSACO 250G conductive carbon black; and ii. at least one non-conductive polymer selected from the group consisting of styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene and MIPELON XM 221U ultra-high molecular weight polyethylene; wherein the non-conductive polymer is present in an amount in the range of from 15 to 25 weight % relative to a total filler loading; and wherein the composite exhibits a tolerance level in the range of from ±0.37 to ±1.0. ### Claim 24 A method for the manufacture of an electrostatic dissipative composite, comprising the steps of: a) providing a thermoplastic polymer composition; b) providing a filler composition, comprising i. a conductive carbon black; and ii. a non-conductive polymer; c) combining the filler composition and the thermoplastic resin to provide a composite, wherein the filler composition is present in the provided composite in a volume percentage loading in the range of from 7.4 to 10.5 relative to a total volume of the composite; and wherein the provided composite exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 25 (depends on 24) The method of claim 24, wherein the thermoplastic polymer composition comprises at least one polycarbonate. ### Claim 26 (depends on 25) The method of claim 25, wherein at least one polycarbonate is a bisphenol A polycarbonate. ### Claim 27 (depends on 24) The method of claim 24, wherein the non-conductive polymer is selected from the group consisting of styrene-acrylonitrile copolymer and ultra-high molecular weight polyethylene. ### Claim 28 (depends on 27) The method of claim 27, wherein the ultra-high molecular weight polyethylene is MIPELON XM 221U. ### Claim 29 (depends on 27) The method of claim 27, wherein the styrene-acrylonitrile copolymer is a styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene. ### Claim 30 (depends on 24) The method of claim 24, wherein the conductive carbon black is ENSACO 250G. ### Claim 31 (depends on 24) The method of claim 24, wherein the non-conductive polymer is present in the provided composite in an amount in the range of from 15 to 25 weight % relative to the total filler loading. ### Claim 32 A method for the manufacture of an electrostatic dissipative composite, comprising the steps of: a) providing a crystalline thermoplastic polymer composition; b) providing a filler composition, comprising i. a conductive carbon black; and ii. a non-conductive polymer; c) combining the filler composition and the thermoplastic polymer composition to provide a composite, wherein the filler composition is present in the provided composite in a volume percentage loading in the range of from 5.0 to 6.0 relative to a total volume of the composite; and wherein the provided composite exhibits a surface resistivity in the range of from 106 ohm/sq to 109 ohm/sq. ### Claim 33 (depends on 32) The method of claim 32, wherein the continuous thermoplastic polymer composition comprises polybutylene terephthalate. ### Claim 34 (depends on 32) The method of claim 32, wherein the conductive carbon black is ENSACO 250 G and the at least one non-conductive polymer is MIPELON XM 221 U. ### Claim 35 (depends on 32) The method of claim 32, wherein the total amount of non-conductive polymer ranges from 15 to 25 weight % of the total filler loading. ### Claim 36 A method for the manufacture of an electrostatic dissipative composite, comprising the steps of: a) providing a thermoplastic polymer composition; b) providing a filler composition comprising i. a conductive carbon black; and ii. a non-conductive polymer; c) combining the filler composition and the thermoplastic polymer composition to provide a composite; wherein the provided composite exhibits a tolerance level in the range of from ±0.37 to ±1.0. ### Claim 37 (depends on 36) The method of claim 36, wherein the thermoplastic polymer composition comprises at least one polymer selected from the group consisting of polycarbonate and polybutylene terephthalate. ### Claim 38 (depends on 37) The method of claim 37, wherein at least one polycarbonate is a bisphenol A polycarbonate. ### Claim 39 (depends on 36) The method of claim 36, wherein at least one non-conductive polymer is selected from the group consisting of styrene-acrylonitrile copolymer and ultra-high molecular weight polyethylene. ### Claim 40 (depends on 39) The method of claim 39, wherein the ultra-high molecular weight polyethylene is MIPELON XM 221U. ### Claim 41 (depends on 39) The method of claim 39, wherein the styrene-acrylonitrile copolymer is a styrene-acrylonitrile copolymer encapsulated polytetrafluoroethylene. ### Claim 42 (depends on 36) The method of claim 36, wherein the conductive carbon black is ENSACO 250G. ### Claim 43 (depends on 36) The method of claim 36, wherein the amount of non-conductive polymer present in the provided filler composition is in the range of from 15 to 25 weight % of the total filler loading.