# US 2014/0197318 A1 · Infrared sensor array with interconnection type and manufacturing method of infrared sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197318 A1 - Document ID: US20140197318A1 - Status: Published application - Kind: A1 - Application number: 13/740,224 - Filed: 2013-01-13 - Published: 2014-07-17 - Earliest claimed: 2013-01-13 - Assignees: Unimems Manufacturing Co., Ltd. - Applicants: Unimems Manufacturing Co., Ltd. - Inventors: TZONG-SHENG LEE - Web page: https://patentgrep.com/patent/US20140197318A1 ## CPC - H10F 71/136: {Singulating, e.g. dicing} - G01J 5/70: Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing - G01J 5/90: Testing, inspecting or checking operation of radiation pyrometers - H10F 39/103: {the at least one element covered by H10F30/00 having potential barriers, e.g. integrated devices comprising photodiodes or phototransistors} - H10P 74/277: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers} - G01J 5/10: using electric radiation detectors - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An infrared sensor array with interconnection type, comprises a substrate, a plurality of circuit units, and a plurality of infrared sensing modules. The substrate defines several sensing segments. Each sensing segment has a base portion, a connecting portion, and a testing portion. The connecting portion is arranged between the base portion and the testing portion. The circuit units are respectively formed on the sensing segments. Each circuit unit has a base circuit, a connecting circuit, and a testing circuit. The connecting circuit electrically connects to the base circuit and the testing circuit. Each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion. The infrared sensing modules are respectively disposed on the base portions and electrically connected to the base circuits. ## Claims ### Claim 1 An infrared sensor array with interconnection type, comprising: a substrate defined a plurality of sensing segments, wherein each sensing segment has a base portion, a connecting portion, and a testing portion, and the connecting portion is arranged between the base portion and the testing portion; a plurality of circuit units respectively formed on the sensing segments, wherein each circuit unit has a base circuit, a connecting circuit, and a testing circuit, and the connecting circuit electrically connects to the base circuit and the testing circuit, wherein each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion; and a plurality of infrared sensing modules respectively disposed on the base portions and electrically connected to the base circuits; wherein each base portion, each corresponding base circuit, and each corresponding infrared sensing module are defined as an infrared sensor, and wherein the infrared sensor array with interconnection type is configured to test the infrared sensors simultaneously by the testing circuits. ### Claim 2 (depends on 1) The infrared sensor array with interconnection type as claimed in claim 1, wherein the testing circuits expose from an outer surface of the substrate. ### Claim 3 (depends on 2) The infrared sensor array with interconnection type as claimed in claim 2, wherein the testing portions and the testing circuits are formed as a golden finger structure. ### Claim 4 (depends on 1) The infrared sensor array with interconnection type as claimed in claim 1, wherein in each infrared sensor, the infrared sensing module comprises: an infrared sensing unit disposed on the base portion and electrically connected to the base circuit; a cover unit having a thru hole, wherein the cover unit is fixed on the base portion and covering the infrared sensing unit; and a filtering unit arranged in the thru hole of the cover unit for enabling the infrared sensing unit to receive an infrared signal via the filtering unit. ### Claim 5 (depends on 4) The infrared sensor array with interconnection type as claimed in claim 4, wherein in each infrared sensor, the infrared sensing unit has a temperature measuring chip aligned to the thru hole of the cover unit and a temperature compensating chip, the temperature measuring chip is configured to receive the infrared signal and a noise, and the temperature compensating chip is configured to receive a noise for eliminating the noise received by the temperature measuring chip. ### Claim 6 (depends on 5) The infrared sensor array with interconnection type as claimed in claim 5, wherein in each infrared sensor, the temperature measuring chip and the temperature compensating chip are connected in one piece to form an elongated structure, the base portion has a square shape, the longitudinal direction of the infrared sensing unit is substantially parallel to a diagonal of the base portion, and the temperature measuring chip and the temperature compensating chip are arranged on the diagonal of the base portion. ### Claim 7 (depends on 5) The infrared sensor array with interconnection type as claimed in claim 5, wherein in each infrared sensor, the temperature measuring chip and the temperature compensating chip are separated from each other, the base portion of the substrate has a square shape, and the temperature measuring chip and the temperature compensating chip are arranged on a diagonal of the base portion. ### Claim 8 (depends on 7) The infrared sensor array with interconnection type as claimed in claim 7, wherein in each infrared sensor, the temperature measuring chip and the temperature compensating chip each has a square shape, a diagonal of the temperature measuring chip and a diagonal of the temperature compensating chip are parallel to the diagonal of the base portion. ### Claim 9 (depends on 4) The infrared sensor array with interconnection type as claimed in claim 4, wherein in each infrared sensor, the infrared sensing module further has a thermistor electrically connected to the base circuit. ### Claim 10 (depends on 4) The infrared sensor array with interconnection type as claimed in claim 4, wherein the filtering units of the infrared sensors are respectively configured to filter different wavelengths of light. ### Claim 11 (depends on 4) The infrared sensor array with interconnection type as claimed in claim 4, wherein in each infrared sensor, the infrared sensing module further has an auxiliary component unit arranged inside the cover unit, and the auxiliary component unit is disposed on the base portion and electrically connected to the base circuit. ### Claim 12 (depends on 1) The infrared sensor array with interconnection type as claimed in claim 1, wherein the substrate defines a first parting line and a plurality of second parting lines, wherein the infrared sensors are arranged on one side of the first parting line, the connecting portions, the testing portions, the connecting circuits, and the testing circuits are arranged on another side of the first parting line, and wherein each second parting line is arranged between each two adjacent base portions. ### Claim 13 (depends on 1) The infrared sensor array with interconnection type as claimed in claim 1, wherein the substrate defines a first parting line and a plurality of second parting lines, wherein the infrared sensors are arranged on one side of the first parting line, the connecting portions, the testing portions, the connecting circuits, and the testing circuits are arranged on another side of the first parting line, and wherein at least two of the base portions are arranged between two adjacent second parting lines. ### Claim 14 (depends on 1) The infrared sensor array with interconnection type as claimed in claim 1, wherein the sensing segments are abreast arranged along a first direction, the base portion, the connecting portion, and the testing portion of each sensing segment are abreast arranged along a second direction, and wherein the first direction is approximately perpendicular to the second direction. ### Claim 15 A manufacturing method of an infrared sensor, comprising: providing a substrate, wherein defining the substrate as a plurality of sensing segments abreast arranged along a first direction, and defining each sensing segment as a base portion, a connecting portion, and a testing portion abreast arranged along a second direction, and wherein the second direction is approximately perpendicular to the first direction; forming a plurality of circuit units respectively on the sensing segments, wherein each circuit unit has a base circuit, a connecting circuit, and a testing circuit, and the connecting circuit electrically connects to the base circuit and the testing circuit, and wherein each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion; and disposing a plurality of infrared sensing modules respectively on the base portions and electrically connecting to the base circuits, thereby forming an infrared sensor array with interconnection type; wherein each base portion, each corresponding base circuit, and each corresponding infrared sensing module are defined as the infrared sensor. ### Claim 16 (depends on 15) The manufacturing method as claimed in claim 15, wherein when the forming of the circuit units, exposing the circuit units from an outer surface of the substrate. ### Claim 17 (depends on 16) The manufacturing method as claimed in claim 16, wherein after the forming of the infrared sensor array with interconnection type, testing the infrared sensors simultaneously by the testing circuits, and then obtaining a row of the infrared sensors connected in one piece along the first direction by removing the connecting portions, the testing portions, the connecting circuits, and the testing circuits. ### Claim 18 (depends on 17) The manufacturing method as claimed in claim 17, wherein after the obtaining of the row of the infrared sensors, cutting the row of the infrared sensors to separate each infrared sensor. ### Claim 19 (depends on 17) The manufacturing method as claimed in claim 17, wherein after the obtaining of the row of the infrared sensors, cutting the row of the infrared sensors to form a plurality of infrared sensor sets, and wherein each infrared sensor set has at least two infrared sensors connected in one piece.