# US 2014/0197151 A1 · Substrate support with switchable multizone heater > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197151 A1 - Document ID: US20140197151A1 - Status: Published application - Kind: A1 - Application number: 13/742,639 - Filed: 2013-01-16 - Published: 2014-07-17 - Earliest claimed: 2013-01-16 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: LEON VOLFOVSKI; MAYUR G. KULKARNI; ALEX MINKOVICH; MICHAEL R. RICE - Web page: https://patentgrep.com/patent/US20140197151A1 ## CPC - H05B 3/26: heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)} - H05B 1/0233: {for semiconductors manufacturing} - H10P 72/0432: {mainly by conduction} - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements. ## Claims ### Claim 1 A substrate support, comprising: a first member to distribute heat to a substrate when present above a first planar surface of the first member; a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present; a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member; and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements. ### Claim 2 (depends on 1) The substrate support of claim 1, wherein each resistive heating element is configured to be independently controlled. ### Claim 3 (depends on 1) The substrate support of claim 1, wherein the plurality of resistive heating elements are grouped into a plurality of heating zones, wherein each of the plurality of heating zones is configured to be independently controlled. ### Claim 4 (depends on 1) The substrate support of claim 1, further comprising: a plurality of temperature monitoring devices to measure temperature disposed on the first member and coupled to a second set of electrical conductors disposed on the fourth member. ### Claim 5 (depends on 4) The substrate support of claim 4, wherein each temperature monitoring devices includes a connection disposed through an opening formed in a corresponding resistive heating element on the second member, and wherein an end of the connection contacts the second set of electrical conductors disposed on the fourth member. ### Claim 6 (depends on 4) The substrate support of claim 4, wherein each temperature monitoring device is printed on a bottom surface of the first member. ### Claim 7 (depends on 4) The substrate support of claim 4, wherein each temperature monitoring device is disposed through one of a plurality of holes formed in the first member such that a top portion of each temperature monitoring device extends to the top surface of the first member. ### Claim 8 (depends on 4) The substrate support of claim 4, wherein the first member is fabricated from dielectric material that has a thermal conductivity of about 25 W/m-K to about 170 W/m-K ### Claim 9 (depends on 1) The substrate support of claim 1, wherein the second member is a ceramic substrate and wherein the plurality of resistive heating elements are fabricated from a metallic material ### Claim 10 (depends on 1) The substrate support of claim 1, wherein the plurality of resistive heating elements are disposed on the second member such that the plurality of resistive heating elements uniformly and substantially cover the entire surface area of the top surface of the second member. ### Claim 11 (depends on 1) The substrate support of claim 1, wherein the first set of electrical conductors disposed on the fourth member are electrically connected to a first set of common wires at a center portion of the fourth member, wherein the first set of common wires is less than the number of resistive heating elements disposed on the second member. ### Claim 12 (depends on 11) The substrate support of claim 11, wherein the first set of common wires feed through a central opening formed in the fourth member. ### Claim 13 (depends on 12) The substrate support of claim 12, wherein the second set of electrical conductors disposed on the fourth member are electrically connected to a second set of common wires at a center portion of the fourth member, wherein the second set of common wires is less than the number of temperature monitoring devices disposed on the first member. ### Claim 14 (depends on 13) The substrate support of claim 13, wherein the second set of common wires feed through the central opening formed in the fourth member. ### Claim 15 (depends on 1) The substrate support of claim 1, wherein each of the one or more base heater zones heats an area of the first member that is greater than one or more of the resistive heater elements. ### Claim 16 (depends on 15) The substrate support of claim 15, wherein the one or more base heater zones are disposed directly below at least some of the plurality of resistive heater elements such that an area of the first member heated by the one or more base heater zones and the at least some of the plurality of resistive heater elements is the same. ### Claim 17 (depends on 1) The substrate support of claim 1, wherein the plurality of resistive heater elements includes at least 7 resistive heater elements to provide a desired temperature profile resolution to the first member. ### Claim 18 (depends on 4) The substrate support of claim 4, further comprising: a control system coupled configured to receive input from the plurality of resistive temperature detectors and to control each of the plurality of resistive heating elements, wherein the control system includes a first multiplexor electrically coupled to the plurality of resistive heating elements and a second multiplexor electrically coupled to the plurality of resistive temperature detectors. ### Claim 19 (depends on 1) The substrate support of claim 1, further comprising: a plurality of substrate support pins disposed on the first planar surface of the first member to support a backside surface of a substrate when present on the substrate support; a plurality of lift pins holes formed through each of the first, second, third and fourth members; and a plurality of substrate lift pins movably disposed in the plurality of lift pins holes and configured to move the substrate onto the plurality of substrate support pins. ### Claim 20 A substrate support, comprising: a multilayer heater comprising: a first member to distribute heat to a substrate when present above a first planar surface of the first member; a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present; a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member; and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements; a plurality of substrate support pins disposed on the first planar surface of the first member to support a backside surface of a substrate when present on the substrate support; a plurality of lift pins holes formed through each of the first, second, third and fourth members; a plurality of substrate lift pins movably disposed in the plurality of lift pins holes and configured to move the substrate onto the plurality of substrate support pins; and a control system coupled configured to receive input from the plurality of resistive temperature detectors and to control each of the plurality of resistive heating elements, wherein the control system includes a first multiplexor electrically coupled to the plurality of resistive heating elements and a second multiplexor electrically coupled to the plurality of resistive temperature detectors.