# US 2014/0197068 A1 · Wafer holding apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0197068 A1 - Document ID: US20140197068A1 - Status: Published application - Kind: A1 - Application number: 14/138,281 - Filed: 2013-12-23 - Published: 2014-07-17 - Earliest claimed: 2013-01-16 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Hyun-Ho CHO; Hyeog-Ki KIM; Kwang-Shin LIM - Web page: https://patentgrep.com/patent/US20140197068A1 ## CPC - H10P 72/1921: {characterised by substrate supports} - H10P 72/1912: {characterised by shock absorbing elements, e.g. retainers or cushions} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer. ## Claims ### Claim 1 A wafer holding apparatus comprising: a container body including a space and a front opening, the space configured to receive a wafer; a door at the front opening; and a first supporting part on an inner wall of the door, the first supporting part including, a frame mounted on the inner wall of the door, a plurality of elastic ribs protruding from the frame and a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, the plurality of grooves spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer. ### Claim 2 (depends on 1) The wafer holding apparatus of claim 1, wherein the first supporting part includes a plurality of wafer contacting portions, and each of the wafer contacting portions includes a first inclined surface and a second inclined surface, the first and second inclined surfaces defining each of the grooves. ### Claim 3 (depends on 2) The wafer holding apparatus of claim 2, wherein the wafer contacting portions are arranged in a direction substantially perpendicular to the wafer, and adjacent wafer contacting portions are configured to be coupled to each other. ### Claim 4 (depends on 2) The wafer holding apparatus of claim 2, wherein the container body includes a top portion, a bottom portion opposite to the top portion, a side portion and a rear portion, the side portion and the rear portion connect the top portion to the bottom portion, second supporting parts are disposed on an inner surface of the side portion, and the first and second supporting parts are configured to support the wafer. ### Claim 5 (depends on 4) The wafer holding apparatus of claim 4, wherein the second supporting part includes a plurality of slits, the slits configured to receive the wafer in an inserted manner. ### Claim 6 (depends on 4) The wafer holding apparatus of claim 4, wherein each of the second supporting parts are disposed on the inner surface of the side portion and an inner surface of the rear portion, and the second supporting part has a shape substantially same as that of the first supporting part. ### Claim 7 (depends on 6) The wafer holding apparatus of claim 6, wherein second supporting part holders on the inner surface of the side portion and the inner surface of the rear portion are configured to hold the second supporting parts, and the second supporting parts are configured to be removable from the second supporting part holders. ### Claim 8 (depends on 2) The wafer holding apparatus of claim 2, wherein a thickness of the elastic ribs of the first supporting part is smaller than that of the frame. ### Claim 9 (depends on 2) The wafer holding apparatus of claim 2, wherein a peak is at a junction at which the second inclined surface and a first inclined surface of an adjacent wafer contacting portion meet, and a protrusion protrudes from the peak in a direction substantially parallel with the wafer. ### Claim 10 (depends on 2) The wafer holding apparatus of claim 2, wherein an angle defined by the first inclined surface and the second inclined surface is about 140 degrees to about 160 degrees. ### Claim 11 (depends on 2) The wafer holding apparatus of claim 2, wherein the wafer contacting portions of the first supporting part includes, a plurality of first contacting portions and a plurality of second contacting portions spaced apart from the first contacting portions, each of the first and second contacting portions has the first inclined surface and the second inclined surfaces, the first and second inclined surfaces defining each of the grooves configured to receive the wafer, and the elastic ribs including first elastic ribs and a second elastic ribs, the first elastic ribs connecting the first wafer contacting portions to the frame and the second elastic ribs connecting the second wafer contacting portions to the frame. ### Claim 12 (depends on 11) The wafer holding apparatus of claim 11, wherein the first wafer contacting portions are arranged in a direction substantially perpendicular to the wafer, the first and second inclined surfaces in each of the first wafer contacting portions arranged continuously and alternately, and the second wafer contacting portions are arranged in the direction substantially perpendicular to the wafer, the first and second inclined surfaces in each of the second wafer contacting portions arranged continuously and alternately. ### Claim 13 (depends on 12) The wafer holding apparatus of claim 12, wherein an angle defined by the first inclined surface and the second inclined surface is about 140 degrees to 160 degrees. ### Claim 14 (depends on 1) The wafer holding apparatus of claim 1, wherein a first supporting part holder is on the inner wall of the door, and the frame of the first supporting part is coupled to the first supporting part holder. ### Claim 15 (depends on 1) The wafer holding apparatus of claim 1, wherein the first supporting part includes thermo-hardening resin. ### Claim 16 A wafer holding apparatus comprising: a container having an open side configured to receive a wafer therethrough; a door configured to close the open side, and a supporting part coupled to the door and including at least one groove configured to hold a peripheral portion of the wafer. ### Claim 17 (depends on 16) The wafer holding apparatus of claim 16, wherein the supporting part includes a corrugated support structure defining the at least one groove. ### Claim 18 (depends on 17) The wafer holding apparatus of claim 17, wherein the supporting part is spaced apart from the door by a plurality of elastic ribs connected to the corrugated support structure. ### Claim 19 (depends on 16) The wafer holding apparatus of claim 16, wherein the door includes a holder configured to couple the supporting part with the door. ### Claim 20 (depends on 19) The wafer holding apparatus of claim 19, further comprising: a plurality of protrusions at a plurality of peaks of the corrugated support structure, the protrusions extending in a direction substantially parallel with the wafer.