# US 2014/0197025 A1 · Hot tile sputtering system

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- Number: US 2014/0197025 A1
- Document ID: US20140197025A1
- Status: Published application
- Kind: A1
- Application number: 14/211,257
- Filed: 2014-03-14
- Published: 2014-07-17
- Earliest claimed: 2009-04-07
- Assignees: Magna Mirrors of America, Inc.
- Applicants: Magna Mirrors of America, Inc.
- Inventors: Ian A. McCabe; Jeffrey D. Harlow
- Web page: https://patentgrep.com/patent/US20140197025A1

## CPC

- C23C 14/3421: {using heated targets}
- C23C 14/3407: {Cathode assembly for sputtering apparatus, e.g. Target}
- H01J 37/3408: {Planar magnetron sputtering}
- H01J 37/3423: {Shape}
- H01J 37/3435: {Target holders (includes backing plates and endblocks)}
- H01J 37/3497: {Temperature of target}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

A method of sputter coating a glass substrate includes providing a glass substrate and providing a sputtering assembly for sputtering a coating onto the glass substrate in a vacuum deposition chamber. The sputtering assembly includes a backing plate and a separating element disposed on the backing plate. At least one target element is provided and disposed at and in contact with a surface of the separating element. The target element is not bonded the separating element when disposed at and in contact with the surface of the separating element. An expansion gap is provided at or adjacent to the target element to allow for expansion of the target element during the sputtering process. Material from the target element is sputtered and the target element is heated to a substantially elevated temperature during the sputtering process. The sputtering process coats a surface of the glass substrate with the target element material.

## Claims

### Claim 1

A method of sputter coating a glass substrate, said method comprising:
providing a glass substrate;
providing a sputtering assembly for sputtering a coating material onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;
providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;
providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;
sputtering coating material from said at least one target element and heating said at least one target element to a substantially elevated temperature during the sputtering process; and
wherein sputtering coating material during the sputtering process comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material.

### Claim 2 (depends on 1)

The method of claim 1, wherein said separating element comprises an electrically conductive material.

### Claim 3 (depends on 1)

The method of claim 1, wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element.

### Claim 4 (depends on 1)

The method of claim 1, wherein said separating element comprises a graphite sheet.

### Claim 5 (depends on 1)

The method of claim 1, wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a substantially greater temperature than said backing plate during the sputtering process.

### Claim 6 (depends on 5)

The method of claim 5, wherein heating said at least one target element comprises heating said at least one target element to a substantially elevated temperature in the range of about 400 degrees C. to about 600 degrees C. during the sputtering process.

### Claim 7 (depends on 1)

The method of claim 1, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating sheet with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the sputtering process.

### Claim 8 (depends on 1)

The method of claim 1, wherein said glass substrate comprises a glass substrate of a reflective element of a mirror assembly for a vehicle, and wherein said at least one target element comprises a metallic coating material that, when sputtered during the sputtering process, establishes a transparent electrically conductive layer at said surface of said glass substrate.

### Claim 9 (depends on 1)

The method of claim 1, comprising providing at least one retaining element for retaining said at least one target element at said separating element and said backing plate.

### Claim 10 (depends on 9)

The method of claim 9, wherein said retaining element comprises an expansion element so as to substantially retain said target elements at said backing plate while allowing for expansion of said target elements during the sputtering process.

### Claim 11 (depends on 1)

The method of claim 1, wherein, during the sputtering process, said at least one target element is capable of movement relative to said surface of said separating element.

### Claim 12

A method of sputter coating a glass substrate, said method comprising:
providing a glass substrate;
providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;
providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;
wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element;
providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;
sputtering coating material from said at least one target element and heating said at least one target element to a substantially elevated temperature during the sputtering process;
wherein, during the sputtering process, said at least one target element is capable of movement relative to said surface of said separating element; and
wherein sputtering coating material during the sputtering process comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material.

### Claim 13 (depends on 12)

The method of claim 12, wherein said separating element comprises an electrically conductive material.

### Claim 14 (depends on 12)

The method of claim 12, wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a substantially greater temperature than said backing plate during the sputtering process.

### Claim 15 (depends on 12)

The method of claim 12, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating sheet with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the sputtering process.

### Claim 16 (depends on 12)

The method of claim 12, wherein said glass substrate comprises a glass substrate of a reflective element of a mirror assembly for a vehicle, and wherein said at least one target element comprises a metallic coating material that, when sputtered during the sputtering process, establishes a transparent electrically conductive layer at said surface of said glass substrate.

### Claim 17

A method of sputter coating a glass substrate, said method comprising:
providing a glass substrate for a reflective element of a mirror assembly for a vehicle;
providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;
providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;
wherein said at least one target element comprises a metallic material;
providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;
sputtering metallic material from said at least one target element and heating said at least one target element to a substantially elevated temperature during the sputtering process;
wherein sputtering metallic material during the sputtering process sputters metallic material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with the metallic material to establish a transparent electrically conductive layer at said surface of said glass substrate;
wherein, during the sputtering process, said at least one target element is capable of movement relative to said surface of said separating element; and
wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a substantially greater temperature than said backing plate during the sputtering process.

### Claim 18 (depends on 17)

The method of claim 17, wherein heating said at least one target element comprises heating said at least one target element to a substantially elevated temperature in the range of about 400 degrees C. to about 600 degrees C. during the sputtering process.

### Claim 19 (depends on 17)

The method of claim 17, wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element;

### Claim 20 (depends on 17)

The method of claim 17, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating sheet with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the sputtering process.
