# US 2014/0196944 A1 · Method for producing a receptacle for a sensor element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196944 A1 - Document ID: US20140196944A1 - Status: Published application - Kind: A1 - Application number: 14/151,907 - Filed: 2014-01-10 - Published: 2014-07-17 - Earliest claimed: 2013-01-11 - Assignees: Robert Bosch GmbH - Applicants: Robert Bosch GmbH - Inventors: Thomas Loibl; Imke Heeren - Web page: https://patentgrep.com/patent/US20140196944A1 ## CPC - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - G01R 1/04: Housings; Supporting members; Arrangements of terminals - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one conductor track to the base layer. A further amount of a pre-ceramic substance is introduced into the mold onto at least a partial region of the conductor track. A top region of the receptacle is formed directly on the base layer while at least partially covering over the conductor track by molding the further pre-ceramic substance in the injection mold. The method also includes debinding and sintering the molded body. The method forms a receptacle for a sensor element that has conductor tracks lying on the inside and incorporated in a gas-tight manner in a ceramic body. ## Claims ### Claim 1 A method for producing a receptacle for a sensor element, comprising: introducing a first amount of a pre-ceramic substance into an injection mold; forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold; applying at least one conductor track to the base layer; introducing a further amount of a pre-ceramic substance into an injection mold onto at least a partial region of the base layer and of the at least one conductor track; forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold; and debinding and sintering the molded body. ### Claim 2 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance comprises zirconium dioxide, silicon dioxide, and cordierite. ### Claim 3 (depends on 1) The method according to claim 1, wherein the at least one conductor track is applied by inmold labeling, direct screen printing, an adhesive imaging technique, doctor blading, dispensing, or tampon printing. ### Claim 4 (depends on 1) The method according to claim 1, wherein the base layer is formed with a surface on which a serration structure is arranged. ### Claim 5 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance is introduced into the injection-molding device from an end face thereof. ### Claim 6 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance comprises a binder system that is selected from the group of thermoplastic binder systems. ### Claim 7 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance comprises a polyacrylate. ### Claim 8 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance comprises polyethylene glycol. ### Claim 9 (depends on 1) The method according to claim 1, wherein the pre-ceramic substance comprises a solids fraction of less than or equal to 55%. ### Claim 10 A method for producing a sensor arrangement, comprising: introducing a first amount of a pre-ceramic substance into an injection mold; forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold; applying at least one conductor track to the base layer; introducing a further amount of a pre-ceramic substance into an injection mold onto at least a partial region of the base layer and of the at least one conductor track; forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold; debinding and sintering the molded body; and applying a sensor element to a receiving region of the receptacle. ### Claim 11 A receptacle for a sensor element, the receptacle produced by a method including: introducing a first amount of a pre-ceramic substance into an injection mold; forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold; applying at least one conductor track to the base layer; introducing a further amount of a pre-ceramic substance into an injection mold onto at least a partial region of the base layer and of the at least one conductor track; forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold; and debinding and sintering the molded body. ### Claim 12 (depends on 1) The method according to claim 1, wherein the receptacle is configured for a combustion chamber pressure sensor. ### Claim 13 (depends on 6) The method according to claim 6, wherein the binder system includes polyvinyl butyral.