# US 2014/0196940 A1 · Through mold via relief gutter on molded laser package (mlp) packages > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196940 A1 - Document ID: US20140196940A1 - Status: Published application - Kind: A1 - Application number: 13/777,298 - Filed: 2013-02-26 - Published: 2014-07-17 - Earliest claimed: 2013-01-11 - Assignees: QUALCOMM Incorporated - Applicants: Qualcomm Incorporated - Inventors: Christopher J. Healy; Gopal C. Jha; Manuel Aldrete - Web page: https://patentgrep.com/patent/US20140196940A1 ## CPC - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - H10W 70/687: {characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage} - H10W 74/131: {the semiconductor body being only partially enclosed} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 2201/0305: Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/072: {of bump connectors} - H10W 72/07236: {Soldering or alloying} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/242: {relative to the surface, e.g. recessed, protruding} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/287: {Flow barriers} - H10W 74/01: Manufacture or treatment - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging. ## Claims ### Claim 1 An apparatus, comprising: a substrate having a plurality of electrical contact pads; a molding layer parallel to the substrate, the molding layer having a top surface; a plurality of solder balls located on the plurality of electrical contact pads and exposed by a plurality of through mold vias arranged in multiple rows and formed in the molding layer, where each of the solder balls in the plurality of solder balls has a vertical diameter and a horizontal diameter; and a plurality of gutters located on an outer portion of, and adjacent to, at least some of the plurality of through mold vias, where each gutter in the plurality of gutters extends vertically from the top surface of the molding layer to a depth equal to or less than half the vertical diameter of a corresponding solder ball. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the multiple rows in the plurality of through mold vias comprise: an outer row of through mold vias extending around a perimeter of the apparatus; and an inner row of through mold vias adjacent to the outer row of through mold vias and extending around the perimeter of the apparatus. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein each through mold via in the outer row of through mold vias has a first outer side facing the perimeter of the apparatus and a first inner side facing a center of the apparatus, and wherein each through mold via in the inner row of through mold vias has second outer side facing the center of the apparatus and a second inner side facing the perimeter of the apparatus. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the each gutter in the plurality of gutters is separate from each other. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the horizontal length of the each gutter in the plurality of gutters is approximately the length of the horizontal diameter of the corresponding solder ball. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the each of the solder balls in the plurality of solder balls is co-planar with the top surface of the molding layer. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein a portion of the molding layer is removed to create the each gutter in the plurality of gutters. ### Claim 8 (depends on 7) The apparatus of claim 7, the removed portion is large enough to accommodate approximately 50% of the corresponding solder ball when melting. ### Claim 9 (depends on 7) The apparatus of claim 7, the removed portion is large enough to accommodate approximately 40%-50% of the corresponding solder ball when melting. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the plurality of gutters provide a pressure relief path for the corresponding solder ball when melting. ### Claim 11 (depends on 1) The apparatus of claim 1, incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. ### Claim 12 An apparatus, comprising: a substrate having a plurality of electrical contact pads; a molding layer parallel to the substrate, the molding layer having a top surface; a plurality of solder balls located on the plurality of electrical contact pads and exposed by a plurality of through mold vias arranged in multiple rows and formed in the molding layer, where each of the solder balls in the plurality of solder balls has a vertical diameter and a horizontal diameter; and a plurality of gutters located on an outer portion of, and adjacent to, at least some of the through mold vias, where at least some of the gutters in the plurality of gutters have a first tier extending from the top surface of the molding layer to a first depth and a second tier extending from the top surface of the molding layer to a second depth, where the first depth and the second depth are different. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein the first and second depths are equal to or less than half the vertical diameter of a corresponding solder ball to provide a pressure relief path for the corresponding solder ball when melting. ### Claim 14 (depends on 12) The apparatus of claim 12, wherein the first depth is equal to or less than half the vertical diameter of a corresponding solder ball and the second depth is equal to or greater than the vertical diameter of the corresponding solder ball to provide a pressure relief path for the corresponding solder ball when melting. ### Claim 15 (depends on 12) The apparatus of claim 12, wherein the multiple rows in the plurality of through mold vias comprise: an outer row of though mold vias extending around a perimeter of the apparatus; and an inner row of through mold vias adjacent to the outer row of through mold vias and extending around the perimeter of the apparatus. ### Claim 16 (depends on 15) The apparatus of claim 15, wherein each through mold via in the outer row of through mold vias has a first outer side facing the perimeter of the apparatus and a first inner side facing a center of the apparatus, and wherein each through mold via in the inner row of through mold vias has a second outer side facing the center of the apparatus and a second inner side facing the perimeter of the apparatus. ### Claim 17 (depends on 12) The apparatus of claim 12, wherein each gutter in the plurality of gutters is separate from each other. ### Claim 18 (depends on 12) The apparatus of claim 12, wherein the horizontal length of each gutter in the plurality of gutters is approximately the length of the horizontal diameter of the corresponding solder ball. ### Claim 19 (depends on 12) The apparatus of claim 12, wherein the each of the solder balls in the plurality of solder balls is co-planar with the top surface of the molding layer. ### Claim 20 (depends on 12) The apparatus of claim 12, wherein a portion of the molding layer is removed to create each gutter in the plurality of gutters. ### Claim 21 (depends on 20) The apparatus of claim 20, the removed portion is large enough to accommodate approximately 50% of the corresponding solder ball when melting. ### Claim 22 (depends on 20) The apparatus of claim 20, the removed portion is large enough to accommodate approximately 40%-50% of the corresponding solder ball when melting. ### Claim 23 (depends on 12) The apparatus of claim 12, incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. ### Claim 24 An apparatus, comprising: a substrate having a plurality of electrical contact pads; a molding layer, having a top surface and a bottom surface, the bottom surface extending across the substrate; a plurality of through mold vias, arranged in multiple rows, extending through the molding layer to the plurality of electrical contact pads; a plurality of solder balls disposed within the plurality of though mold vias on the plurality of electrical contact pads, where each of the solder balls in the plurality of solder balls has a vertical diameter and a horizontal diameter; and a plurality of gutters located on an outer portion of, and adjacent to, at least some of the through mold vias, where at least some of the gutters in the plurality of gutters extend vertically from the top surface of the molding layer to a depth equal to or less than half the vertical diameter of a first corresponding solder ball; and where at least some of the gutters in the plurality of gutters have a first tier extending vertically from the top surface of the molding layer to a first depth and a second tier extending vertically from the top surface of the molding layer to a second depth, where the first depth and the second depth are different. ### Claim 25 (depends on 24) The apparatus of claim 24, wherein the first and second depths are equal to or less than half the vertical diameter of a second corresponding solder ball to provide a pressure relief path for the second corresponding solder ball when melting. ### Claim 26 (depends on 24) The apparatus of claim 24, wherein the first depth is equal to or less than half the vertical diameter of a second corresponding solder ball and the second depth is equal to or greater than the vertical diameter of the second corresponding solder ball to provide a pressure relief path for the corresponding solder ball when melting. ### Claim 27 (depends on 24) The apparatus of claim 24, wherein the multiple rows in the plurality of through mold vias comprise: an outer row of through mold vias extending around a perimeter of the apparatus; and an inner row of through mold vias adjacent to the outer row of through mold vias and extending around the perimeter of the apparatus. ### Claim 28 (depends on 27) The apparatus of claim 27, wherein each through mold via in the outer row of through mold vias has a first outer side facing the perimeter of the apparatus and a first inner side facing a center of the apparatus, and wherein each through mold via in the inner row of through mold vias has a second outer side facing the center of the apparatus and a second inner side facing the perimeter of the apparatus. ### Claim 29 (depends on 24) The apparatus of claim 24, wherein each gutter in the plurality of gutters is separate from each other. ### Claim 30 (depends on 24) The apparatus of claim 24, wherein the horizontal length of each gutter in the plurality of gutters is approximately the length of the horizontal diameter of the corresponding solder ball. ### Claim 31 (depends on 24) The apparatus of claim 24, wherein the each of the solder balls in the plurality of solder balls is co-planar with the top surface of the molding layer. ### Claim 32 (depends on 24) The apparatus of claim 24, wherein a portion of the molding layer is removed to create each gutter in the plurality of gutters. ### Claim 33 (depends on 32) The apparatus of claim 32, the removed portion is large enough to accommodate approximately 50% of the corresponding solder ball when melting. ### Claim 34 (depends on 32) The apparatus of claim 32, the removed portion is large enough to accommodate approximately 40%-50% of the corresponding solder ball when melting. ### Claim 35 (depends on 24) The apparatus of claim 24, wherein the plurality of gutters provide a pressure relief path for the corresponding solder ball when melting. ### Claim 36 (depends on 24) The apparatus of claim 24, incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. ### Claim 37 A method for manufacturing a Molded Laser Package (MLP) Package, comprising: providing a substrate; providing one or more electrical contact pads in the substrate; providing one or more solder balls on top of the one or more electrical contact pads, the one or more solder balls having a vertical diameter and a horizontal diameter; providing a molding layer on a top surface of the substrate covering the substrate and the one or more solder balls placed on the one or more electrical contact pads; forming one or more through mold vias by selectively removing portions of the molding layer over the one or more solder balls to expose a portion of the one or more solder balls; and forming gutters by selectively removing portions of the molding layer on an outer portion of, and adjacent to at least some of the one or more through mold vias, where each portion removed extends vertically from a top surface of the molding layer to a depth equal to or less than half the vertical diameter of a corresponding solder ball. ### Claim 38 (depends on 37) The method of claim 37, further comprising: forming a second substrate; forming one or more second electrical contact pads in the second substrate; and electrically coupling the second substrate to the molding layer, the one or more second electrical contact pads aligned with and contacting the one or more solder balls. ### Claim 39 (depends on 37) The method of claim 37, wherein each removed portion of the molding layer is separate from each other. ### Claim 40 (depends on 37) The method of claim 37, wherein each removed portion of the molding layer has a length approximately the length of the horizontal diameter of the corresponding solder ball. ### Claim 41 (depends on 37) The method of claim 37, wherein the each portion removed provides a pressure relief path for the corresponding solder ball when melting. ### Claim 42 (depends on 32) The method of claim 32, wherein the gutters provide a pressure relief path for the corresponding solder ball when melting. ### Claim 43 (depends on 32) The method of claim 32, further comprising: incorporating the MLP package within a semiconductor die; and integrating the semiconductor die into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. ### Claim 44 An apparatus, comprising: a substrate having a plurality of electrical contact pads; a molding means parallel to the substrate, the molding means having a top surface; a plurality of solder balls located on the plurality of electrical contact pads and exposed by a plurality of through vias arranged in multiple rows and formed in the molding means, where each of the solder balls in the plurality of solder balls has a vertical diameter and a horizontal diameter; and an electrical short preventing means located on an outer portion of, and adjacent to, at least some of the plurality of through vias where the electrical short preventing means extends vertically from the top surface of the molding means to a depth equal to or less than half the vertical diameter of a corresponding solder ball. ### Claim 45 (depends on 44) The apparatus of claim 44, incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.