# US 2014/0196939 A1 · Wiring board

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- Number: US 2014/0196939 A1
- Document ID: US20140196939A1
- Status: Published application
- Kind: A1
- Application number: 14/235,729
- Filed: 2013-04-10
- Published: 2014-07-17
- Earliest claimed: 2012-05-16
- Assignees: Ngk Spark Plug Co., Ltd.
- Applicants: Ngk Spark Plug Co., Ltd.
- Inventors: Tomohiro Nishida; Seiji Mori; Makoto Wakazono
- Web page: https://patentgrep.com/patent/US20140196939A1

## CPC

- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/3452: Solder masks
- H05K 2201/09881: Coating only between conductors, i.e. flush with the conductors
- H05K 2201/10977: Encapsulated connections
- H05K 2203/025: Abrading, e.g. grinding or sand blasting
- H05K 2203/0783: Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.

## Claims

### Claim 1

A wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated, the wiring board comprising:
a plurality of connecting terminals formed separately from one another on the laminated body;
a filling member filled up between the plurality of connecting terminals, the filling member being in contact with at least a part of each side surface of the plurality of connecting terminals; and
a solder resist layer laminated on the laminated body, the solder resist layer including an opening that exposes the plurality of connecting terminals, wherein
the filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.

### Claim 2 (depends on 1)

The wiring board according to claim 1, wherein
the filling member has a surface roughness (Ra) of 0.06 μm to 0.8 μm.

### Claim 3 (depends on 1)

The wiring board according to claim 1, wherein
the solder resist layer has a surface roughness (Ra) of 0.02 μm to 0.25 μm.

### Claim 4 (depends on 1)

The wiring board according to claim 1, wherein
the solder resist layer includes the opening with an inner peripheral surface, the inner peripheral surface having a surface roughness rougher than a surface roughness of the top surface of the solder resist layer.

### Claim 5 (depends on 1)

The wiring board according to claim 1, wherein
the filling member functions as a solder resist.

### Claim 6 (depends on 1)

The wiring board according to claim 1, wherein
at least a part of the connecting terminal projects from a surface of the filling member.