Heat sink thermal press for phase change heat sink material
AssigneeFlextronics AP, LLC
InventorsDason Cheung, Murad Kurwa, Richard Loi
Life of this patent
Estimating the term…
Abstract
Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
Claims31
An apparatus for heat sink assembly comprising:
- a. a movable thermal head;
- and
- b. a user control unit configured to control the thermal head to mount a heat sink to a circuit board.
A method of assembling an electronic device comprising:
- a) heating a first thermal head;
- b) heating a heat sink and a thermal pad above a pre-determined temperature via the first thermal head;
- and
- c) attaching the heat sink to an electronic circuit board via the thermal pad.
A controlling unit for heat sink assembly comprising:
- a) a graphical user interface;
- b) a programmable logic controller configured to receive information through the graphical user interface;
- c) a pneumatic cylinder controlled by the programmable logic controller;
- and
- d) a thermal head mechanically coupling with the pneumatic cylinder, wherein the thermal head comprises a heating element controlled by the programmable logic controller.
Dependencies are inferred from the claim text.