# US 2014/0196878 A1 · Thermal dissipater apparatus for use with electronic devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196878 A1 - Document ID: US20140196878A1 - Status: Published application - Kind: A1 - Application number: 13/742,013 - Filed: 2013-01-15 - Published: 2014-07-17 - Earliest claimed: 2013-01-15 - Assignees: Research In Motion Limited - Applicants: Research In Motion Corporation - Inventors: Martin Earl Holman, IV; Patrick Yves Mas; Rohit Koppal - Web page: https://patentgrep.com/patent/US20140196878A1 ## CPC - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H10W 40/10: Arrangements for heating - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - F28F 3/02: Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) - Y10T 29/4935: Heat exchanger or boiler making - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity. ## Claims ### Claim 1 A thermal dissipater shield apparatus comprising: a body defining a lateral wall; a first wall projecting from an inner surface of the lateral wall defining a first cavity; and a second wall to project from the inner surface of the lateral wall defining a second cavity, the first wall is spaced apart from the second wall, and the first cavity is isolated from the second cavity. ### Claim 2 (depends on 1) The shield apparatus of claim 1, further comprising an opening formed through the lateral wall to enable access to the first cavity. ### Claim 3 (depends on 1) The shield apparatus of claim 1, wherein body further comprises a heat fin positioned adjacent a perimeter edge of the lateral wall. ### Claim 4 (depends on 3) The shield apparatus of claim 3, wherein the heat fin extends between an outer surface of the second wall and a perimeter edge of the lateral wall. ### Claim 5 (depends on 1) The shield apparatus of claim 1, wherein the first wall is substantially parallel relative to the second wall. ### Claim 6 (depends on 1) The shield apparatus of claim 1, wherein a perimeter of the second wall is greater than a perimeter of the first wall. ### Claim 7 (depends on 1) The shield apparatus of claim 1, wherein a dimensional length and width of the lateral wall is greater than a dimensional length and width defined by the first cavity. ### Claim 8 (depends on 7) The shield apparatus of claim 7, wherein the dimensional length and width of the lateral wall is greater than a dimensional length and width defined by the second cavity. ### Claim 9 (depends on 1) The shield apparatus of claim 1, wherein a dimensional height of the first wall is substantially similar to a dimensional height of the second wall. ### Claim 10 An assembly comprising: a thermal dissipater shield having a first wall defining a first cavity and a second wall defining a second cavity, the first cavity is separated from the second cavity, the thermal dissipater having a lateral wall extending over the first wall and the second wall to define the first cavity and the second cavity; and a thermal gel to be applied in the first cavity and across substantially an entire surface area of the lateral wall. ### Claim 11 (depends on 10) The assembly of claim 10, further comprising a thermal spreader to be positioned on the lateral wall. ### Claim 12 (depends on 10) The assembly of claim 10, wherein the thermal dissipater shield includes a plurality of heat fins positioned along a portion of the perimeter edge of the lateral wall. ### Claim 13 (depends on 10) The assembly of claim 10, wherein the first wall projects away from the lateral wall. ### Claim 14 (depends on 13) The assembly of claim 13, wherein the second wall projects away from the lateral wall, the second wall to encompass or surround the first wall. ### Claim 15 (depends on 14) The assembly of claim 14, wherein the first wall is substantially parallel to the second wall, and wherein the first and second walls are substantially perpendicular relative to the lateral wall. ### Claim 16 (depends on 15) The assembly of claim 15, wherein a perimeter edge of the second wall extends beyond the second wall. ### Claim 17 A method comprising: coupling a thermal dissipater shield to a substrate of an electronic device, the heat dissipater shield having a lateral wall and a first cavity; capturing an integrated circuit chip positioned on the substrate in the first cavity when the thermal dissipater shield is coupled to the substrate, the first cavity isolating the integrated circuit chip from discrete components surrounding the integrated circuit, the lateral wall providing a surface area that is greater than a surface area defined by the integrated circuit; applying a thermal gel in the first cavity of the heat dissipater shield to substantially cover all surfaces of the integrated circuit that are in communication with the first cavity; and applying the thermal gel to an outer surface of the lateral wall. ### Claim 18 (depends on 17) The method of claim 17, wherein applying a thermal gel to the first cavity comprises applying the thermal gel to the first cavity via an opening provided in the lateral wall. ### Claim 19 (depends on 17) The electronic device of claim 17, further comprising causing the lateral surface to extend over a neighboring heat shield when the thermal dissipater shield is coupled to the substrate, the lateral surface to dissipate heat from the neighboring heat shield. ### Claim 20 (depends on 17) The electronic device of claim 17, further comprising capturing a discrete electronic components in a second cavity of the thermal dissipater shield when the heat dissipater shield is positioned on the substrate, the second cavity being isolated from the first cavity, and wherein the lateral wall extends over the second cavity.