# US 2014/0196853 A1 · Method For Detaching A Semiconductor Chip From A Foil > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196853 A1 - Document ID: US20140196853A1 - Status: Published application - Kind: A1 - Application number: 14/085,693 - Filed: 2013-11-20 - Published: 2014-07-17 - Earliest claimed: 2012-11-23 - Assignees: Besi Switzerland AG - Applicants: Besi Switzerland AG - Inventors: Ernst Barmettler; Irving Rodriguez - Web page: https://patentgrep.com/patent/US20140196853A1 ## CPC - H10P 72/04: {Apparatus for manufacture or treatment} - B32B 43/006: {Delaminating} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - H10W 72/07168: {Means for storing or moving the material for the connector} - H10W 72/07178: {Means for aligning} - Y10S 156/932: with poking during delaminating, e.g. jabbing release sheet backing to remove wafer - Y10S 156/943: with poking delaminating means, e.g. jabbing means - Y10T 156/1105: Delaminating process responsive to feed or shape at delamination - Y10T 156/1179: with poking during delaminating [e.g., jabbing, etc.] - Y10T 156/1983: Poking delaminating means - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime. ## Claims ### Claim 1 Method for detaching semiconductor chips from a foil, the method comprising a setup phase for determining and setting time periods which each defines a duration of a prepeeling step of the detachment process, wherein during each prepeeling step firstly at least one area of the semiconductor chip remains sticked to the foil and is bent and afterwards detaches from the foil, the setup phase comprising the following steps: illuminating a semiconductor chip to be removed with light which impinges substantially perpendicularly onto the surface of the semiconductor chip; carrying out the following steps for each prepeeling step whose duration is to be determined: initiating the prepeeling step; repeating the two steps: recording of an image of the semiconductor chip and assigning a time period to the image which has passed since the initiation of the prepeeling step, and checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value; and assigning to the prepeeling step the time period associated with the last recorded image or a time period derived therefrom. ### Claim 2 Method for detaching semiconductor chips from a foil, the method comprising the following steps: illuminating a semiconductor chip to be removed with light which impinges substantially perpendicularly onto the surface of the semiconductor chip; carrying out at least one prepeeling step, in which firstly at least one region of the semiconductor chip remains sticked to the foil and is bent and afterwards detaches from the foil, wherein each of the at least one prepeeling steps comprises the following steps: initiating the prepeeling step; repeating the two steps: recording of an image of the semiconductor chip, and checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value; and at the end of the last prepeeling step grasping the semiconductor chip by a chip gripper and completing the detachment of the semiconductor chip from the foil. ### Claim 3 (depends on 1) Method according to claim 1, the method further comprising using a die ejector with liftable and lowerable plates for the detachment of the semiconductor chips from the foil, wherein the aforementioned initiation in the at least one prepeeling step contains the lowering of the outermost plates which have not yet been lowered. ### Claim 4 (depends on 2) Method according to claim 2, the method further comprising using a die ejector with liftable and lowerable plates for the detachment of the semiconductor chips from the foil, wherein the aforementioned initiation in the at least one prepeeling step contains the lowering of the outermost plates which have not yet been lowered. ### Claim 5 (depends on 1) Method according to claim 1, the method further comprising using a die ejector with a carriage, which is displaceable parallel to the surface of the foil, for the detachment of the semiconductor chips from the foil, wherein the aforementioned initiation in the at least one prepeeling step comprises the displacement of the carriage by a predetermined distance. ### Claim 6 (depends on 2) Method according to claim 2, the method further comprising using a die ejector with a carriage, which is displaceable parallel to the surface of the foil, for the detachment of the semiconductor chips from the foil, wherein the aforementioned initiation in the at least one prepeeling step comprises the displacement of the carriage by a predetermined distance.