# US 2014/0196832 A1 · Subfloor component and method of manufacturing same

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- Number: US 2014/0196832 A1
- Document ID: US20140196832A1
- Status: Published application
- Kind: A1
- Application number: 14/217,181
- Filed: 2014-03-17
- Published: 2014-07-17
- Earliest claimed: 2012-03-05
- Inventors: Victor Amend
- Web page: https://patentgrep.com/patent/US20140196832A1

## CPC

- E04F 15/185: {Underlayers in the form of studded or ribbed plates}
- B29C 44/14: the preformed part being a lining {(B29C44/1209 takes precedence)}
- B29C 44/445: {in the form of expandable granules, particles or beads}
- B32B 3/085: {spaced apart pieces on the surface of a layer}
- B32B 13/045: {of foam}
- B32B 15/046: {of foam}
- B32B 21/02: {the layer being formed} of fibres, chips, or particles {, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard}
- B32B 21/047: {of foam}
- B32B 21/14: comprising wood board or veneer
- B32B 27/065: {of foam}
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 2307/558: Impact strength, toughness
- B32B 2307/734: Dimensional stability
- B32B 2471/00: Floor coverings (B32B2419/04 takes precedence)
- E04F: FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS (windows, doors E06B)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

A method of manufacturing a subfloor component comprises: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have a plurality of pedestals with walls extending from a first face of the panel toward a second opposing face of the panel; placing a substantially moisture-impervious film into the mold adjacent to the pedestal-forming structures; placing heat-expandable beads into the mold against the film opposite the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the film fused thereto; removing the panel with the fused film from the mold; and attaching a hardboard layer to the second face of the panel.

## Claims

### Claim 1

A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
placing a substantially moisture-impervious film into the mold adjacent to the pedestal-forming structures;
placing heat-expandable beads into the mold against the film opposite the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the film fused thereto;
removing the panel with the fused film from the mold; and
attaching a hardboard layer to the second face of the panel.

### Claim 2

A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
placing a substantially moisture-impervious film into the mold adjacent to the pedestal-forming structures;
applying heat to the mold to fuse the film to the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto;
removing the panel with the fused film from the mold; and
attaching a hardboard layer to the second face of the panel.

### Claim 3

A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
removing the panel from the mold;
placing a substantially moisture-impervious film adjacent the first face of the panel;
applying heat to one or both of the film and the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto; and
attaching a hardboard layer to the second face of the panel.

### Claim 4 (depends on 3)

The method of claim 3, wherein placing the substantially moisture-impervious film comprises placing the film in contact with and/or in non-contact proximity with the first face of the panel.