# US 2014/0196749 A1 · Cryogenic liquid cleaning apparatus and methods

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- Number: US 2014/0196749 A1
- Document ID: US20140196749A1
- Status: Published application
- Kind: A1
- Application number: 14/146,382
- Filed: 2014-01-02
- Published: 2014-07-17
- Earliest claimed: 2013-01-15
- Applicants: Applied Materials, Inc.
- Inventors: Jianshe Tang; Sidney P. Huey; Lakshmanan Karuppiah
- Web page: https://patentgrep.com/patent/US20140196749A1

## CPC

- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 70/20: {Cleaning during device manufacture}
- H10P 70/277: {the processing being a planarisation of conductive layers}
- H10P 70/60: {Cleaning only by mechanical processes}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A cryogenic cleaning apparatus is disclosed. The cryogenic cleaning apparatus has a source of cryogen, a nozzle coupled to the source of cryogen, the nozzle including a main passage adapted to receive the cryogen, one or more auxiliary gas inlets adapted to supply an auxiliary gas to mix with the cryogen either within the nozzle or at a nozzle exit of the nozzle to produce cryogen droplets, and a heated holder adapted to receive a substrate to be cleaned. Cryogenic cleaning methods adapted to clean substrates are provided, as are numerous other aspects.

## Claims

### Claim 1

A cryogenic cleaning apparatus, comprising:
a source of cryogen adapted to deliver a cryogen;
a nozzle coupled to the source of cryogen, the nozzle including a main passage adapted to receive the cryogen and one or more auxiliary gas inlets adapted to supply an auxiliary gas from an auxiliary gas source and to mix with the cryogen either within the nozzle or at a nozzle exit of the nozzle; and
a heated holder adapted to receive a substrate to be cleaned.

### Claim 2 (depends on 1)

The cryogenic cleaning apparatus of claim 1, comprising an auxiliary gas inlet.

### Claim 3 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the one or more auxiliary gas inlets are coupled to one or more auxiliary gas outlets that surround a nozzle exit.

### Claim 4 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the one or more auxiliary gas inlets are coupled into the main passage.

### Claim 5 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the heated holder is coupled to a heat source.

### Claim 6 (depends on 5)

The cryogenic cleaning apparatus of claim 5, wherein the heat source is controllable.

### Claim 7 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the cleaning apparatus is devoid of a vacuum chamber.

### Claim 8 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the auxiliary gas comprises N2, He, or Ar.

### Claim 9 (depends on 1)

The cryogenic cleaning apparatus of claim 1, wherein the cryogen comprises N2, Ar, or CO2.

### Claim 10

A method of cleaning a substrate, comprising:
providing a substrate in a heated holder;
heating the substrate to an operational temperature above room temperature; and
spraying a cryogen onto a surface of the substrate from a nozzle wherein particles are dislodged from the surface using a combination of momentum transfer and a thermophoretic force.

### Claim 11 (depends on 10)

The method of claim 10, comprising assisting the spraying of the cryogen with an auxiliary gas.

### Claim 12 (depends on 10)

The method of claim 10, comprising heating the substrate between about 30° C. and about 90° C.

### Claim 13 (depends on 10)

The method of claim 10, wherein the spraying the cryogen commences after being in contact with the heated holder for about 5 seconds.

### Claim 14 (depends on 10)

The method of claim 10, wherein the spraying produces a cryogen ice.

### Claim 15 (depends on 13)

The method of claim 13, wherein the spraying produces a cryogen ice having an average droplet size of between about 5 microns and about 200 microns.

### Claim 16 (depends on 13)

The method of claim 13, wherein the spraying removes particles that are 40 nm or smaller.