# US 2014/0196744 A1 · Method and device for cleaning a brush surface having a contamination > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196744 A1 - Document ID: US20140196744A1 - Status: Published application - Kind: A1 - Application number: 13/740,128 - Filed: 2013-01-11 - Published: 2014-07-17 - Earliest claimed: 2013-01-11 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Jiann-Lih WU; Jeng-Jyi HWANG; Soon-Kang HUANG; Chi-Ming YANG - Web page: https://patentgrep.com/patent/US20140196744A1 ## CPC - A46B 17/06: Devices for cleaning brushes after use - A46B: BRUSHES (handles not integral with brushware B25G) ## Abstract A method for cleaning a brush surface having a contamination is provided. The method includes steps of: providing a mechanical wave; and stripping off the contamination from the brush surface by the mechanical wave. ## Claims ### Claim 1 A method for cleaning a brush surface having a contamination, comprising steps of: providing a mechanical wave; and stripping off the contamination from the brush surface by the mechanical wave. ### Claim 2 (depends on 1) A method as claimed in claim 1, wherein the contamination includes a contaminant particle having a particle surface, the brush surface has a first surface charge thereon, the particle surface has a second surface charge thereon, the first surface charge has an electric polarity the same with that of the second surface charge, and the method further comprises steps of: enhancing the second surface charge, so that the contaminant particle is repelled from the brush surface; and causing the brush surface to have a motion. ### Claim 3 (depends on 2) A method as claimed in claim 2, wherein: the electric polarity is negative; and the motion includes a rotation. ### Claim 4 (depends on 2) A method as claimed in claim 2, wherein the step of enhancing the second surface charge on the particle surface is performed by a functional water process. ### Claim 5 (depends on 2) A method as claimed in claim 2, wherein the step of enhancing the second surface charge on the particle surface is performed by a chemical process. ### Claim 6 (depends on 1) A method as claimed in claim 1, wherein: the mechanical wave is a megasonic wave, and is applied to the brush surface through a fluid; the fluid includes one of a functional water and an alkaline solution; and the brush surface is used to clean a wafer in a chemical-mechanical planarization process. ### Claim 7 A method for cleaning a brush surface having a first surface charge and a contaminant particle having a particle surface having a second surface charge, wherein the first surface charge has an electric polarity the same with that of the second surface charge, comprising a step of: causing the second surface charge to be enhanced, so that the contaminant particle is repelled from the brush surface. ### Claim 8 (depends on 7) A method as claimed in claim 7, wherein the electric polarity is negative. ### Claim 9 (depends on 7) A method as claimed in claim 7, wherein the step of enhancing the second surface charge is performed by a functional water process. ### Claim 10 (depends on 9) A method as claimed in claim 9, wherein the functional water process is performed by adding an H2 water to form a solution system for reducing a oxidation/reduction potential of the solution system. ### Claim 11 (depends on 7) A method as claimed in claim 7, wherein the step of enhancing the second surface charge is performed by a chemical process. ### Claim 12 (depends on 11) A method as claimed in claim 11, wherein the chemical process is performed by adding an alkaline solution to reduce a zeta potential of the contaminant particle. ### Claim 13 (depends on 11) A method as claimed in claim 11, wherein the chemical process is used to facilitate a dissociation of a functional group from the contaminant particle. ### Claim 14 A device for cleaning a brush surface having a first surface charge and a contaminant particle having a particle surface having a second surface charge, wherein the first surface charge has an electric polarity the same with that of the second surface charge, comprising: a cleaning module configured to enhance the second surface charge on the particle surface, so that the contaminant particle is repelled from the brush surface. ### Claim 15 (depends on 14) A device as claimed in claim 14, further comprising: a bath including a pool region, a bottom region, an inlet region and a first wall disposed above the inlet region, wherein the inlet region provides a fluid to the pool region therethrough, and the fluid includes at least one of a functional water and an alkaline solution; a megasonic device disposed in the bottom region, and providing a mechanical wave; a discharge unit including an overflow region surrounding the first wall, a second wall surrounding the overflow region, and an outlet region, wherein when the pool region overflows, an overflow portion of the fluid is discharged through the overflow region and the outlet region. ### Claim 16 (depends on 15) A method as claimed in claim 15, wherein the mechanical wave is a megasonic wave. ### Claim 17 (depends on 15) A device as claimed in claim 15, wherein the cleaning module performs a functional water process to reduce a oxidation/reduction potential of the fluid. ### Claim 18 (depends on 14) A device as claimed in claim 14, wherein the cleaning module performs a chemical process to reduce a zeta potential of the contaminant particle. ### Claim 19 (depends on 14) A device as claimed in claim 14, wherein the contaminant particle is one selected from a group consisting of a PSi, an Si3N4, an SiO2, an Al2O3, and the combination thereof. ### Claim 20 (depends on 14) A device as claimed in claim 14, further comprising a detector detecting an electric polarity of one of the first and second surface charges.