# US 2014/0196541 A1 · Sensor, sensor unit, and method for producing a sensor unit

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- Number: US 2014/0196541 A1
- Document ID: US20140196541A1
- Status: Published application
- Kind: A1
- Application number: 14/235,100
- Filed: 2012-06-19
- Published: 2014-07-17
- Earliest claimed: 2011-08-16
- Assignees: Robert Bosch GmbH
- Inventors: Michael Hofsaess
- Web page: https://patentgrep.com/patent/US20140196541A1

## CPC

- G01P 1/003: {used for damping}
- G01D 3/036: on measuring arrangements themselves
- G01P 3/14: by exciting one or more mechanical resonance systems
- G01P 15/0802: {Details}
- Y10T 29/49128: Assembling formed circuit to base
- G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G})
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A sensor includes a sensor element configured to measure a physical variable. At least one elastic damping element is configured to damp external interfering vibrations. The at least one elastic damping element is configured to electrically and/or mechanically contact the sensor element.

## Claims

### Claim 1

A sensor, comprising:
a sensor element configured to measure a physical variable; and
at least one elastic damping element configured to damp external interference oscillations and configured to electrically and/or mechanically contact the sensor element.

### Claim 2 (depends on 1)

The sensor as claimed in claim 1, wherein the at least one elastic damping element includes at least one spring element with at least one contact element.

### Claim 3 (depends on 2)

The sensor as claimed in claim 2, wherein the at least one spring element is a stamped and bent part.

### Claim 4 (depends on 2)

The sensor as claimed in claim 2, wherein the spring element is enveloped by an elastic damping material.

### Claim 5 (depends on 1)

The sensor as claimed in claim 1, wherein the at least one elastic damping element is an elastic conductive glue connection having a specified viscosity and/or ductility.

### Claim 6 (depends on 1)

The sensor as claimed in claim 1, wherein the sensor element is configured to measure an acceleration and/or a rotation rate.

### Claim 7

A sensor unit, comprising:
a sensor, including:
a sensor element configured to measure a physical variable; and
at least one elastic damping element configured to damp external interference oscillations and configured to electrically and/or mechanically contact the sensor element; and
a circuit board on which the sensor is disposed.

### Claim 8

A method for manufacturing a sensor unit having a circuit board and a sensor with a sensor element, the method comprising:
connecting the sensor element of the sensor to at least one elastic damping element; and
connecting the sensor element to the circuit board via electrical and/or mechanical contact with the at least one elastic damping element.

### Claim 9 (depends on 8)

The method for manufacturing a sensor unit as claimed in claim 8, wherein:
the at least one elastic damping element is made of at least one spring element with at least one contact element,
the at least one spring element is manufactured in a stamping and bending process and the at least one spring element is cast with an elastic damping material following connection to the sensor element, and
the contact element is omitted during casting of the at least one spring element.

### Claim 10 (depends on 8)

The method for manufacturing a sensor unit as claimed in claim 8, wherein:
the at least one elastic damping element is at least one conductive glue connection having a specified viscosity and/or ductility, and
the at least one conductive glue connection is introduced between the circuit board and the sensor element to connect the sensor element electrically and mechanically to the circuit board.

### Claim 11 (depends on 4)

The sensor as claimed in claim 4, wherein the elastic damping material is liquid silicon rubber.