# US 2014/0196540 A1 · Two-axis vertical mount package assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0196540 A1 - Document ID: US20140196540A1 - Status: Published application - Kind: A1 - Application number: 13/741,198 - Filed: 2013-01-14 - Published: 2014-07-17 - Earliest claimed: 2013-01-14 - Assignees: Analog Devices Technology - Applicants: Analog Devices, Technology - Inventors: Arturo Martizon, JR.; Thomas M. Goida - Web page: https://patentgrep.com/patent/US20140196540A1 ## CPC - B81C 3/008: {Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002} - B81B 7/0074: {3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board} - H10W 70/429: {being the outer leads} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 156/10: Methods of surface bonding and/or assembly therefor - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation. ## Claims ### Claim 1 A vertical mount package assembly comprising: a base substrate having electrical connections for affixing to external circuitry; a package having a device region configured to receive at least one device; and a plurality of flexible electrical leads between the base substrate and the package, wherein the flexible leads include aligned grooves. ### Claim 2 (depends on 1) The vertical mount package assembly of claim 1, wherein the package is fixed in a position substantially perpendicular to the base substrate. ### Claim 3 (depends on 2) The vertical mount package assembly of claim 2, wherein the base substrate and the package each include beveled edges configured to mate. ### Claim 4 (depends on 2) The vertical mount package assembly of claim 2, wherein the package is fixed with an adhesive between the base substrate and the package. ### Claim 5 (depends on 4) The vertical mount package assembly of claim 4, wherein the adhesive comprises epoxy ### Claim 6 (depends on 1) The vertical mount package assembly of claim 1, further comprising a MEMS die on the device region of the package. ### Claim 7 (depends on 6) The vertical mount package assembly of claim 6, wherein the plurality of flexible electrical leads provide electrical communication between the MEMS die and the electrical connections of the base substrate. ### Claim 8 (depends on 6) The vertical mount package assembly of claim 6, wherein the base substrate further comprises an integrated circuit communicating with the flexible electrical leads and the electrical connections. ### Claim 9 (depends on 6) The vertical mount package assembly of claim 6, wherein the MEMS die comprises at least one of: an accelerometer and a gyroscope. ### Claim 10 A vertical mount package assembly comprising: a base substrate having electrical connections for affixing to external circuitry; a package having a device region configured to receive at least one device; a plurality of flexible electrical leads between the base substrate and the package, wherein the base substrate and the package each include beveled edges configured to mate when the base substrate and package are substantially orthogonal to one another. ### Claim 11 (depends on 10) The vertical mount package assembly of claim 10, further comprising a MEMS die on the device region of the package. ### Claim 12 (depends on 11) The vertical mount package assembly of claim 11, wherein the MEMS die comprises at least one of: an accelerometer and a gyroscope. ### Claim 13 A method of manufacturing a vertical mount package assembly, the method comprising: providing a base, wherein the base includes electrical connections for affixing to external circuitry; providing a package, wherein the package includes a device region configured to receive at least one device; providing flexible electrical leads between the base and the package, wherein the flexible leads include aligned grooves; and rotating the package relative to the base substrate, wherein aligned grooves constrain the relative positions of the substrates during rotation, and wherein the flexible electrical leads maintain the connection between the base substrate and the package after rotation. ### Claim 14 (depends on 13) The method of claim 13, wherein the substrates include beveled edges that mate to provide a substantially perpendicular orientation between the substrates after rotation. ### Claim 15 (depends on 14) The method of claim 14, further comprising fixing the package to the base substrate in the substantially perpendicular orientation. ### Claim 16 (depends on 15) The method of claim 15, wherein fixing the package to the base substrate comprises applying adhesive between the substrates. ### Claim 17 (depends on 13) The method of claim 13, wherein the package includes a MEMS die on the device region of the package. ### Claim 18 (depends on 17) The method of claim 17, wherein the MEMS die comprises an accelerometer. ### Claim 19 (depends on 17) The method of claim 17, wherein the MEMS die comprises a gyroscope. ### Claim 20 (depends on 17) The method of claim 17, wherein the base substrate includes an integrated circuit die encapsulated therein, the integrated circuit die electrically communicating with the MEMS die and the flexible electrical leads. ### Claim 21 (depends on 13) The method of claim 13, wherein the package includes an integrated circuit on the device region of the package.