# US 2014/0196280 A1 · Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

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- Number: US 2014/0196280 A1
- Document ID: US20140196280A1
- Status: Published application
- Kind: A1
- Application number: 14/217,744
- Filed: 2014-03-18
- Published: 2014-07-17
- Earliest claimed: 2010-10-21
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd
- Inventors: Chang-Seong JEON; Ho-Geon SONG; Mitsuo UMEMOTO; Sang-Sick PARK
- Web page: https://patentgrep.com/patent/US20140196280A1

## CPC

- H10W 72/011: {Apparatus therefor}
- H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 90/00: Package configurations
- H10W 72/01271: {Cleaning, e.g. oxide removal or de-smearing}
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07118: {Means for cleaning, e.g. brushes}
- H10W 72/07131: {Means for applying material, e.g. for deposition or forming coatings}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07183: {Means for monitoring}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07254: {changes in dispositions}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/731: {of die-attach connectors}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/53178: Chip component
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.

## Claims

### Claim 1

An apparatus to attach a semiconductor chip, the apparatus comprising:
a flux-dotting unit to sequentially dotting a flux on a first preliminary bump and a second preliminary bump of a package substrate; and
a chip-attaching unit arranged adjacent to the flux-dotting unit to sequentially attach preliminary bumps of first and second semiconductor chips to the first and second preliminary bumps of the package substrate.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the flux-dotting unit comprises:
a dotting head configured to store the flux; and
a nozzle installed at the head, the nozzle having nozzle holes to dot the flux on the first and second preliminary bumps of the package substrate.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein the flux-dotting unit further comprises a gap-adjusting member to adjust a gap between the nozzle and the first and second preliminary bumps of the package substrate.

### Claim 4 (depends on 3)

The apparatus of claim 3, wherein the gap-adjusting member comprises:
a rod extending from the nozzle and making contact with the package substrate; and
a spring connected between the rod and the nozzle.

### Claim 5

An apparatus that attaches a semiconductor chip, the apparatus comprising:
a flux-dotting unit to deposit a first flux on at least one first substrate bump of a package substrate, and to deposit a second flux on at least one second substrate bump in response to an attachment signal; and
a chip-attaching unit that attaches at least one first chip bump of a first semiconductor chip to the at least one first substrate bump in response to a flux output signal.

### Claim 6 (depends on 5)

The apparatus of claim 5, further comprising at least one control module in electrical communication with the flux-dotting unit and the chip-attaching unit that generates the flux output signal in response to flux-dotting unit depositing the first flux, and that generates and that generates the attachment signal in response to the chip-attaching unit attaching the at least one first chip bump to the at least one first substrate bump.

### Claim 7 (depends on 6)

The apparatus of claim 6, wherein the flux-dotting unit includes a flux-dotting module that generates the flux output signal in response to depositing the first flux, and the chip-attaching module includes a chip-attaching module in electrical communication with the flux-dotting module that generates the chip attachment signal in response to attaching the at least one first chip bump to the at least one first substrate bump.