# US 2014/0193655 A1 · Copper alloy sheet with excellent heat dissipation and workability in repetitive bending

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- Number: US 2014/0193655 A1
- Document ID: US20140193655A1
- Status: Published application
- Kind: A1
- Application number: 14/008,733
- Filed: 2012-02-28
- Published: 2014-07-10
- Earliest claimed: 2011-03-30
- Assignees: JX Nippon Mining & Metals Corporation
- Inventors: Ikuya Kurosaki
- Web page: https://patentgrep.com/patent/US20140193655A1

## CPC

- H01B 1/026: {Alloys based on copper}
- C22C 9/00: Alloys based on copper
- C22C 9/02: with tin as the next major constituent
- C22C 9/04: with zinc as the next major constituent
- C22C 9/06: with nickel or cobalt as the next major constituent
- C22C 9/10: with silicon as the next major constituent
- C22F 1/08: of copper or alloys based thereon
- H05K 1/02: Details
- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- Y10T 428/12: All metal or with adjacent metals
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)≧0.5.

## Claims

### Claim 1

A copper alloy sheet comprising not less than one type of element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, amounting to a total of not less than 0.01% by mass, no more than 1.0% by mass of Ag, no more than of 0.08% by mass of Ti, no more than 2.0% by mass of Ni, no more than 3.5% by mass of Zn, not less than one type of element selected from the group of Cr, Fe, In, P, Si, Sn, and Zr, amounting to a total of no more than of 0.5% by mass, and the remainder of Cu and impurities, said copper alloy sheet
having an electrical conductivity of not less than 60% IACS,
having a tensile strength of not less than 350 MPa, and
satisfying the relation defined by the following formula of I(311)/I0(311) in the X-ray diffraction intensity determined by X-ray diffraction of the surface of a sheet in the thickness direction:
I(311)/I0(311)≦0.5.

### Claim 2 (depends on 1)

A copper alloy sheet according to claim 1, wherein tensile strength is not less than 250 MPa after heating at 200° C. for 30 minutes.

### Claim 3

(canceled)

### Claim 4

(canceled)

### Claim 5 (depends on 1, 2)

A copper alloy sheet according to claim 1 or 2, wherein the thickness of the copper alloy sheet is from 0.05 to 0.3 mm.

### Claim 6 (depends on 1, 2)

An electronic component comprising a copper alloy sheet according to claim 1 or 2.

### Claim 7 (depends on 1, 2)

A flexible printed circuit board comprising a copper alloy sheet according to claim 1 or 2.

### Claim 8 (depends on 5)

An electronic component comprising a copper alloy sheet according to claim 5.