# US 2014/0193599 A1 · Kind of light-heat dual curing anisotropic conductive adhesive anisotropic conductive film and their preparation methods

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- Number: US 2014/0193599 A1
- Document ID: US20140193599A1
- Status: Published application
- Kind: A1
- Application number: 14/128,629
- Filed: 2013-04-24
- Published: 2014-07-10
- Earliest claimed: 2012-05-17
- Assignees: Shenzhen Fisher Industrial Co., Ltd.
- Applicants: Shenzhen Fisher Industrial Co., Ltd
- Inventors: Ren-Liang Xiao; Chang-Hou Zhao; Cheng-Cui Liu; Xian-Fei Wan; Chang-Wu Yang; Hua-Guo Yin
- Web page: https://patentgrep.com/patent/US20140193599A1

## CPC

- B05D 3/067: {Curing or cross-linking the coating}
- C09J 7/22: Plastics; Metallised plastics
- C09J 7/35: Heat-activated
- C09J 9/02: Electrically-conducting adhesives
- C09J 11/00: Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J 175/14: Polyurethanes having carbon-to-carbon unsaturated bonds
- B05D 3/065: {After-treatment}
- B05D 5/10: to obtain an adhesive surface
- B05D 5/12: to obtain a coating with specific electrical properties
- B05D 7/04: to surfaces of films or sheets (producing layered products by applying coatings of pasty or pulverulent plastics B29C41/00)
- C08K 3/08: Metals
- C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators}
- C08K 7/18: inorganic
- C08K 2003/0831: {Gold}
- C09J 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- Y10T 428/1471: Protective layer
- Y10T 428/2809: including irradiated or wave energy treated component
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability.

## Claims

### Claim 1

A kind of light-heat dual curing anisotropic conductive adhesive including: light curing activated monomer 15.0-8.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the above-mentioned components are counted according to weight percentage.

### Claim 2 (depends on 1)

The light-heat dual curing anisotropic conductive adhesive according to the claim 1, wherein said conductive adhesive furtherly includes plasticizer whose weight percentage is 3.0-6.0%.

### Claim 3 (depends on 1)

The light-heat dual curing anisotropic conductive adhesive according to the claim 1, wherein said conductive adhesive furtherly includes coupling agent whose weight percentage is 0.5-1.0%.

### Claim 4 (depends on 1)

The light-heat dual curing anisotropic conductive adhesive according to the claim 1, wherein said conductive adhesive furtherly includes leveling agent whose weight percentage is 0.5-1.5%.

### Claim 5 (depends on 1)

The light-heat dual curing anisotropic conductive adhesive according to the claim 1, wherein said conductive adhesive furtherly includes antioxidant whose weight percentage is 0.5-1.0%.

### Claim 6

A kind of light-heat dual curing anisotropic conductive film comprising a plastic film basic material and a conductive adhesive layer, and a kind of light-heat dual curing anisotropic conductive adhesive being coated on the plastic film basic material and then being cured with ultraviolet light to form said conductive adhesive layer;
Said light-heat dual curing anisotropic conductive adhesive consisting of light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent 0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein the above-mentioned components are counted according to weight percentage.

### Claim 7 (depends on 6)

The light-heat dual curing anisatropic conductive film according to the claim 6, wherein the conductive film furtherly comprises a protective film that is covered on the conductive adhesive layer.

### Claim 8 (depends on 6)

The light-heat dual curing anisotropic conductive film according to the claim 6, wherein the material of the above-mentioned plastic film basic material is polyethylene terephthalate.

### Claim 9 (depends on 7)

The light-heat dual curing anisotropic conductive film according to the claim 7, wherein the material of the above-mentioned plastic film basic material is polyethylene terephthalate.

### Claim 10 (depends on 6)

A kind of preparation method of the light-heat dual curing anisotropic conductive film according to the claim 6 comprising:
Step one, weighing light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent 0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein the above-mentioned components are counted according to weight percentage;
Step two, putting the solid-state light-cured resin, thermosetting resin and elastomer in a dispersing mixer, then heating them to melt to form a mixture, wherein the melting temperature is between 130° C. to 150° C.;
Step three, putting the liquid-state light curing activated monomer and plasticizer in the above-mentioned mixture, wherein the temperature is below 80° C.;
Step four, putting the leveling agent, antioxidant and insulating nanoparticles in the above-mentioned mixture one by one;
Step five, putting the conductive particles in the above-mentioned mixture;
Step six, putting the light curing agent, latent heat curing agent and coupling agent in the above mixture, so that a light-heat dual curing anisotropic conductive adhesive is produced;
Step seven, coating the above-mentioned conductive adhesive on a plastic film basic material with a coating machine;
Step eight, the semi-finished product which is gotten in step seven being cured and being dried with a UV curing machine to form a conductive adhesive layer, so that a light-heat dual curing anisotropic conductive film is produced;
Step nine, the semi-finished product which is gotten in step eight being cut roughly and carefully with a slitting, machine and being rolled to get a kind of anisotropic conductive adhesive film.

### Claim 11 (depends on 7)

A kind of preparation method of the light-heat dual curing anisotropic conductive film according to the claim 7 comprising:
Step one, weighing light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent 0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein the above-mentioned components are counted according to weight percentage;
Step two, putting the solid-state light-cured resin, thermosetting resin and elastomer in a dispersing mixer, then heating them to melt to form a mixture, wherein the melting temperature is between 130° C. to 150° C,;
Step three, putting the liquid-state light curing activated monomer and plasticizer in the above-mentioned mixture, wherein the temperature is below 80° C.;
Step four, putting the leveling agent, antioxidant and insulating nanoparticles in the above-mentioned mixture one by one;
Step five, putting the conductive particles in the above-mentioned mixture;
Step six, putting the light curing agent, latent heat curing agent and coupling agent in the above mixture, so that a light-heat dual curing anisotropic conductive adhesive is produced;
Step seven, coating the above-mentioned conductive adhesive on a plastic film basic material with a coating machine;
Step eight, the semi-finished product which is gotten in step seven being cured and being dried with a UV curing machine to form a conductive adhesive layer;
Step nine, a protective film being covered on the conductive adhesive layer, so that a light-heat dual curing anisotropic conductive film is produced;
Step ten, the semi-finished product which is gotten in step nine being cut roughly and carefully with a slitting machine and being rolled to get a kind of anisotropic conductive adhesive film.