# US 2014/0193160 A1 · Optical module

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- Number: US 2014/0193160 A1
- Document ID: US20140193160A1
- Status: Published application
- Kind: A1
- Application number: 14/192,294
- Filed: 2014-02-27
- Published: 2014-07-10
- Earliest claimed: 2011-09-29
- Assignees: Fujitsu Limited
- Applicants: Fujitsu Limited
- Inventors: Takatoshi YAGISAWA; Takashi SHIRAISHI
- Web page: https://patentgrep.com/patent/US20140193160A1

## CPC

- H04B 10/40: Transceivers
- G02B 6/4246: {Bidirectionally operating package structures}
- G02B 6/4269: {with heat sinks or radiation fins}
- G02B 6/4284: {of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627)}
- H04B 10/2589: {Bidirectional transmission}
- H04B: TRANSMISSION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An optical module includes: a first circuit board on which a connector socket is mounted, an optical transceiver module that is electrically connected to the first circuit board via the connector socket; a heat sink; and a heat dissipating sheet. The optical transceiver module includes: a second circuit board on which an E/O converter, a drive circuit for the E/O converter, an O/E converter, and a current-to-voltage conversion circuit for the O/E converter are mounted; and an optical waveguide that guides an optical signal generated by the E/O converter to an output end of the optical transceiver module, and that guides an input optical signal to the O/E converter. The heat sink is thermally coupled to the E/O converter, the drive circuit, the O/E converter, and the current-to-voltage conversion circuit via the heat dissipating sheet, and presses the optical transceiver module onto the first circuit board.

## Claims

### Claim 1

An optical module comprising:
a first circuit board on which a connector socket is mounted;
an optical transceiver module that is electrically connected to the first circuit board via the connector socket;
a heat sink; and
a heat dissipating sheet, wherein
the optical transceiver module comprises:
a second circuit board on which an electrical-to-optical converter, a drive circuit that drives the electrical-to-optical converter, an optical-to-electrical converter, and a current-to-voltage conversion circuit that converts an output current of the optical-to-electrical converter into a voltage signal are face-down mounted; and
an optical waveguide that guides an optical signal generated by the electrical-to-optical converter to an output end of the optical transceiver module, and that guides an optical signal input to the optical transceiver module to the optical-to-electrical converter, and wherein
the heat sink is thermally coupled to the electrical-to-optical converter, the drive circuit, the optical-to-electrical converter, or the current-to-voltage conversion circuit, or any combination thereof via the heat dissipating sheet, and the heat sink presses the optical transceiver module onto the first circuit board.

### Claim 2 (depends on 1)

The optical module according to claim 1, wherein
one end of the second circuit board is held by a connector socket mounted on the first circuit board, and
a portion of the second circuit board is held to the first circuit board by the optical waveguide and an adhesive.

### Claim 3 (depends on 1)

The optical module according to claim 1, wherein
one end of the second circuit board is held by a connector socket mounted on the first circuit board, and
a portion of the second circuit board is held to the first circuit board by the optical waveguide, a lens that optically couples the waveguide with the electrical-to-optical converter and the optical-to-electrical converter, and an adhesive.

### Claim 4 (depends on 1)

The optical module according to claim 1, wherein the optical transceiver module is electrically connected to each surface of the first circuit board.

### Claim 5 (depends on 4)

The optical module according to claim 4, wherein
the heat sink includes a first heat sink and a second heat sink, and
the first circuit board is sandwiched by the first and second heat sinks so that the optical transceiver module is pressed onto each surface of the first circuit board.

### Claim 6 (depends on 1)

The optical module according to claim 1, wherein a control circuit that controls the drive circuit and the current-to-voltage conversion circuit is mounted on the first circuit board.

### Claim 7 (depends on 1)

The optical module according to claim 1, wherein
the electrical-to-optical converter, the drive circuit, the optical-to-electrical converter, and the current-to-voltage conversion circuit are face-down mounted on one surface of the second circuit board, and
the optical waveguide is stuck to the other surface of the second circuit board.

### Claim 8 (depends on 1)

The optical module according to claim 1, wherein the first circuit board has an edge connector corresponding to a vertical connection type edge connector socket.

### Claim 9 (depends on 1)

The optical module according to claim 1, wherein the second circuit board is a flexible printed circuit.

### Claim 10 (depends on 1)

A blade server that includes a plurality of blades, wherein
each of the plurality of blades has the optical module according to claim 1, and an optical signal is transmitted between the optical modules.