# US 2014/0192832 A1 · Electro-optical module

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- Number: US 2014/0192832 A1
- Document ID: US20140192832A1
- Status: Published application
- Kind: A1
- Application number: 13/905,703
- Filed: 2013-05-30
- Published: 2014-07-10
- Earliest claimed: 2013-01-04
- Assignees: Siliconware Precision Industries Co., Ltd.
- Applicants: Siliconware Precision Industries Co., Ltd.
- Inventors: Chih-Yuan Shih; Shih-Liang Peng; Jung-Pin Huang; Chin-Yu Ku; Hsien-Wen Chen
- Web page: https://patentgrep.com/patent/US20140192832A1

## CPC

- H10W 90/00: Package configurations
- H01S 5/02253: using lenses
- H01S 5/02326: Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H01S 5/02345: Wire-bonding
- H01S 5/0236: using an adhesive
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H01S 5/06226: {Modulation at ultra-high frequencies}
- H01S 5/423: {having a vertical cavity}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

An electro-optical module is provided, which includes: a substrate having a first surface with a groove and an opposite second surface; a plurality of support members disposed on the first surface of the substrate; at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof; an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer, thereby reducing signal losses, improving alignment precision, and achieving preferred thermal dissipation and EMI shielding effects.

## Claims

### Claim 1

An electro-optical module, comprising:
a substrate having a first surface with a groove and a second surface opposite to the first surface;
a plurality of support members disposed on the first surface of the substrate;
at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof;
an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and
a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer.

### Claim 2 (depends on 1)

The module of claim 1, wherein the support members are located at an outer periphery of the groove.

### Claim 3 (depends on 1)

The module of claim 1, further comprising a thermally conductive adhesive layer formed in the groove for fixing the electro-optical element in the groove of the substrate.

### Claim 4 (depends on 1)

The module of claim 1, wherein the electro-optical element is a light-emitting element or a photo-detecting element.

### Claim 5 (depends on 1)

The module of claim 1, further comprising a semiconductor chip disposed in the groove of the substrate and electrically connected to the interposer.

### Claim 6 (depends on 1)

The module of claim 1, further comprising a microcontroller disposed on the first surface of the substrate.

### Claim 7 (depends on 1)

The module of claim 1, wherein the support members are made of a metal.

### Claim 8 (depends on 1)

The module of claim 1, wherein a plurality of thermally conductive through holes are formed in the groove and penetrating the substrate.

### Claim 9 (depends on 1)

The module of claim 1, wherein the interposer has opposite third and fourth surfaces, the fourth surface faces the first surface of the substrate and the third surface has a metal layer formed thereon.

### Claim 10 (depends on 9)

The module of claim 9, wherein a conductive via is formed to penetrate the interposer for electrically connecting the metal layer to the substrate.

### Claim 11 (depends on 1)

The module of claim 1, wherein the interposer has opposite third and fourth surfaces, and the fourth surface faces the first surface of the substrate and has a metal layer, an insulating layer, and an electrical trace layer sequentially formed thereon.

### Claim 12 (depends on 1)

The module of claim 1, wherein the interposer has opposite third and fourth surfaces, the fourth surface faces the first surface of the substrate and the third surface has a soft material layer formed thereon.

### Claim 13 (depends on 12)

The module of claim 12, wherein the soft material layer is made of polyimide (PI), benzocyclobutene (BCB) or polybenzoxazole (PBO).

### Claim 14

An electro-optical module, comprising:
a substrate having opposite first and second surfaces and a cavity penetrating the first and second surfaces;
a heat sink having opposite top and bottom surfaces and disposed in the cavity in a manner that the bottom surface of the heat sink is exposed from the second surface of the substrate;
a plurality of support members disposed on the first surface of the substrate;
at least an electro-optical element having opposite active and non-active surfaces and disposed on the top surface of the heat sink via the non-active surface thereof;
an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and
a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer.

### Claim 15 (depends on 14)

The module of claim 14, wherein the support members are located at an outer periphery of the cavity.

### Claim 16 (depends on 14)

The module of claim 14, wherein the electro-optical element is a light-emitting element or a photo-detecting element, and is disposed on the top surface of the heat sink via a thermally conductive adhesive layer.

### Claim 17 (depends on 14)

The module of claim 14, further comprising a semiconductor chip disposed in a concave portion on the top surface of the heat sink and electrically connected to the interposer.

### Claim 18 (depends on 14)

The module of claim 14, further comprising a microcontroller disposed on the first surface of the substrate.

### Claim 19 (depends on 14)

The module of claim 14, wherein the support members are made of a metal.

### Claim 20 (depends on 14)

The module of claim 14, wherein the interposer has opposite fifth and sixth surfaces, and the fifth surface faces the first surface of the substrate and has a metal layer, an insulating, and an electrical trace layer sequentially formed thereon.

### Claim 21 (depends on 14)

The module of claim 14, wherein the interposer has opposite fifth and sixth surfaces, the fifth surface faces the first surface of the substrate and the sixth surface has a metal layer formed thereon.

### Claim 22 (depends on 14)

The module of claim 14, wherein the interposer has opposite fifth and sixth surfaces, the fifth surface faces the first surface of the substrate and the sixth surface has a soft material layer formed thereon.

### Claim 23 (depends on 22)

The module of claim 22, wherein the soft material layer is made of polyimide (PI), benzocyclobutene (BCB) or polybenzoxazole (PBO).