# US 2014/0192514 A1 · Backlight Module, Printed Circuit Board Used for Backlight Module, and Manufacturing Method for The Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192514 A1 - Document ID: US20140192514A1 - Status: Published application - Kind: A1 - Application number: 13/811,279 - Filed: 2013-01-11 - Published: 2014-07-10 - Earliest claimed: 2013-01-09 - Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd. - Inventors: Che-chang Hu; Kuang-Yao Chang; Qian Cao - Web page: https://patentgrep.com/patent/US20140192514A1 ## CPC - H05K 3/02: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - G02B 6/0085: {Means for removing heat created by the light source from the package} - G02F 1/1336: {Illuminating devices} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - G02F 1/133612: {Electrical details} - G02F 1/133628: {with cooling means} - H05K 2201/0761: Insulation resistance, e.g. of the surface of the PCB between the conductors - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/0228: Cutting, sawing, milling or shearing - H05K 2203/302: Bending a rigid substrate; Breaking rigid substrates by bending - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS ## Abstract The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board. ## Claims ### Claim 1 A backlight module, wherein, the backlight module comprises a light bar and a printed circuit board, and the printed circuit board comprising: a light bar region used for mounting the light bar of the backlight module, being formed with a conductive circuit for supplying power for the light bar, comprising an aluminum (Al) layer of the light bar region, a dielectric layer of the light bar region, a conductive layer and an insulating layer, wherein the Al layer of the light bar region, the dielectric layer of the light bar region, the conductive layer and the insulating layer overlap sequentially; and a heat dissipating region connected with the light bar region, comprising an Al layer of the heat dissipating region and a dielectric layer of the heat dissipating region wherein the Al layer of the heat dissipating region and the dielectric layer of the heat dissipating region overlap sequentially; wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. ### Claim 2 (depends on 1) The backlight module according to claim 1, wherein, the cutting slot is a V-shaped slot. ### Claim 3 (depends on 1) The backlight module according to claim 1, wherein, the printed circuit board is a metal-based printed circuit board. ### Claim 4 (depends on 2) The backlight module according to claim 2, wherein, the light bar is a side-light type LED lamp. ### Claim 5 A printed circuit board for a backlight module, wherein, the printed circuit board comprising: a light bar region used for mounting a light bar of the backlight module, being formed with a conductive circuit for supplying power for the light bar; and a heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. ### Claim 6 (depends on 5) The printed circuit board according to claim 5, wherein, the cutting slot is a V-shaped slot. ### Claim 7 (depends on 5) The printed circuit board according to claim 5, wherein, the printed circuit board is a metal-based printed circuit board. ### Claim 8 (depends on 7) The printed circuit board according to claim 7, wherein, the cutting slot is a V-shaped slot. ### Claim 9 A manufacturing method for a printed circuit board of a backlight module, wherein, manufacturing method comprises: etching and patterning a conductive layer on a light bar region used for mounting the light bar and disposed on the printed circuit board to form a conductive circuit for supplying power to the light bar, and etching and cleaning a conductive layer on a heat dissipating region used for heat dissipation and disposed on the printed circuit board; cutting a connection location between the light bar region and the heat dissipating region to form a cutting slot, wherein the cutting slot is located at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. ### Claim 10 (depends on 9) The manufacturing method according to claim 9, wherein, the printed circuit board is a metal-based printed circuit board and the step of cutting a connection location between the light bar region and the heat dissipating region to form a cutting slot comprising: proceeding V-shaped cutting to form a V-shaped slot at the connection location between the light bar region and the heat dissipating region.