# US 2014/0192506 A1 · Lead frame

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- Number: US 2014/0192506 A1
- Document ID: US20140192506A1
- Status: Published application
- Kind: A1
- Application number: 14/146,201
- Filed: 2014-01-02
- Published: 2014-07-10
- Earliest claimed: 2013-01-10
- Assignees: Mitsui High-Tec, Inc.
- Applicants: Mitsui High-Tec, Inc.
- Inventors: Takahiro ISHIBASHI
- Web page: https://patentgrep.com/patent/US20140192506A1

## CPC

- H10W 72/0198: {batch processes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A lead frame includes adjacent die pads which lie adjacent to each other; grounding leads extended from the adjacent die pads; a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected. The grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame, the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and a support projection is provided at the one surface on the connecting bar in the common axis.

## Claims

### Claim 1

A lead frame, comprising:
adjacent die pads which lie adjacent to each other;
grounding leads extended from the adjacent die pads;
a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected, wherein
the grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame,
the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and
a support projection is provided at the one surface on the connecting bar in the common axis.

### Claim 2 (depends on 1)

The lead frame according to claim 1, wherein
a width dimension of the support projection in the connecting bar is the same as a width dimension of the connecting bar.

### Claim 3 (depends on 1)

The lead frame according to claim 1, wherein
a width dimension of the support projection in the connecting bar is larger than a width dimension of the connecting bar and smaller than a width dimension of a dicing line, along which the connecting bar is removed.

### Claim 4 (depends on 1)

The lead frame according to claim 1, wherein
a width dimension of the support projection in the grounding lead is the same as a width dimension of the grounding lead.